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IC封装资料_电容_GRM1885C1H160JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121212944.07 KB30页255
IC封装资料_电容_0805F103M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215861.05 MB27页255
IC封装资料_电容_CL21B224KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B224KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121567361.01 KB3页255
IC封装资料_电容_GRM1885C1H8R2BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12797944.07 KB30页255
IC封装资料_连接器_1829183.pdf
https://www.phoenixcontact.com/us/products/182918310/28/2014Page1/5Basestrip-GMSTBV2,5/5-GF-7,62-1829183Pleasebeinformedthatthedat...
2024-12-121737177.77 KB5页255
IC封装资料_电源管理芯片_LTC6803IG-1_PBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12683504.73 KB40页255
IC封装资料_过压保护_1SMA10CAT3.pdf
©SemiconductorComponentsIndustries,LLC,2006May,2006−Rev.91PublicationOrderNumber:1SMA10CAT3/D1SMA10CAT3Series400WattPeakPowerZen...
2024-12-1259146.91 KB5页255
IC封装资料_非易失性存储器_MB85RC16PNF.pdf
FUJITSUSEMICONDUCTORDATASHEETCopyright©2011FUJITSUSEMICONDUCTORLIMITEDAllrightsreserved2011.6MemoryFRAM16K(2K×8)BitI2CMB85RC16■...
2024-12-121341222.36 KB20页255
IC封装资料_电感_SWPA8040S331MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124151.32 MB22页255
IC封装资料_电容_CL10A225MQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121179360.84 KB3页255
IC封装资料_电感_SWPA4018S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127671.32 MB22页255
IC封装资料_电容_GRM21BR61H225KA73L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12125510.43 MB296页255
IC封装资料_电容_CL10A105KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12651259.58 KB3页255
IC封装资料_电容_CL05C2R7BB5NNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-121827319.33 KB3页255
IC封装资料_电源管理芯片_LT8609EMSE_TRPBF.pdf
LT8609/LT8609A/LT8609B1Rev.IFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTION42V,3ASynchronous...
2024-12-124642.02 MB30页255
IC封装资料_电源管理芯片_LT3970EMS-3.3_TRPBF.pdf
LT3970Series13970fcTypicalapplicaTionDescripTion40V,350mAStep-DownRegulatorwith2.5µAQuiescentCurrentandIntegratedDiodesTheLT®397...
2024-12-12871405.24 KB22页255
IC封装资料_电源管理芯片_LT3790EFE_PBF.pdf
LT379013790faFormoreinformationwww.linear.com/LT3790TYPICALAPPLICATIONFEATURESDESCRIPTION60VSynchronous4-SwitchBuck-BoostControlle...
2024-12-12119803.6 KB28页255
IC封装资料_连接器_1734354.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12843326.8 KB2页255
IC封装资料_电容_0402N180J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1220001.26 MB20页255
IC封装资料_电感_NLV32T-R18J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121129224.35 KB10页255

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