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IC封装资料_电容_CL10B104KC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121380259.58 KB3页251
IC封装资料_电感_YNR2512-100M.pdf
SMDPowerInductors-YNR2512Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121229661.28 KB5页251
IC封装资料_电容_CL10Y105MR5NJNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12211259.58 KB3页251
IC封装资料_接口及驱动芯片_SN74LVC16T245DGGR.pdf
ToSevenOtherChannels1DIR1A11B11OEToSevenOtherChannels2DIR2A12B12OE14724364822513ProductFolderSample&BuyTechnicalDocumentsTools&Sof...
2024-12-1216301.28 MB34页251
IC封装资料_光电器件_EL357N_B__TA_-G.pdf
4PINULTRASMALLSOPPHOTOTRANSISTORPHOTOCOUPLEREverlightElectronicsCo.,Ltd.1http://www.everlight.comDocumentNo：DPC-0000014Rev.4Decem...
2024-12-121137971.42 KB11页251
IC封装资料_连接器_1758128.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12167836.13 MB445页251
IC封装资料_电感_SWPA8040S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128341.32 MB22页251
IC封装资料_电容_C0603NP0101JGT.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-122601.92 MB48页251
IC封装资料_电感_SDFL1005Q2R2KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121273457.75 KB7页251
IC封装资料_电容_GJM1555C1H6R0CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12196010.43 MB296页251
IC封装资料_电容_CC0603ZRY5V9BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218101.22 MB13页251
IC封装资料_电源管理芯片_LT1962EMS8-5_PBF.pdf
LT1962Series11962fa1962fbFormoreinformationwww.linear.com/LT1962TypicalapplicaTionDescripTion300mA,LowNoise,MicropowerLDORegulator...
2024-12-12398558.05 KB18页251
IC封装资料_电源管理芯片_LT1587CT-3.3_PBF.pdf
1LT1584/LT1585/LT1587158457aAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOU7A,4.6A,3ALowDropoutFastResponsePositiveRegulatorsAdj...
2024-12-1278304.77 KB16页251
IC封装资料_电容_GCM1555C1H181JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-126815.94 MB73页251
IC封装资料_电容_0805F225Z250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126571.26 MB20页250
IC封装资料_连接器_1844249.pdf
https://www.phoenixcontact.com/pi/products/184424904/09/2019Page1/4Feed-throughheader-MC1,5/5-G-3,5-1844249Pleasebeinformedthatthe...
2024-12-121053249.83 KB4页250
IC封装资料_电容_CL10B182KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121807259.57 KB3页250
IC封装资料_电容_CL21B225KAFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B225KAFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-128261.46 MB36页250
IC封装资料_电感_YNR3015-1R5M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12866665.41 KB5页250
IC封装资料_电容_CL10F474ZB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12256259.57 KB3页250

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