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IC封装资料_电容_CL21C020CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-124807.46 MB84页237
IC封装资料_电容_CL21B333KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125851.45 MB36页237
IC封装资料_连接器_1830693.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12151836.13 MB445页237
IC封装资料_电容_CL21B221KCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B221KCANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12234368.86 KB3页237
IC封装资料_电容_CL10B105KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-127021.45 MB36页237
IC封装资料_连接器_1-917658-2.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12133193.5 KB1页237
IC封装资料_电容_0805CG100J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12851.05 MB27页237
IC封装资料_电容_GRM155R61E224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121851920.26 KB29页237
IC封装资料_电容_CL10B102KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12209361.47 KB3页237
IC封装资料_电源管理芯片_LTC4267IGN-3_TRPBF.pdf
LTC4267-3142673fbFormoreinformationwww.linear.com/LTC4267-3PoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulator...
2024-12-121172473.89 KB34页237
IC封装资料_电容_C0603NP0270JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1213491.92 MB48页237
IC封装资料_电容_GRM1555C1H8R2CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121255920.26 KB29页237
IC封装资料_电感_SWPA4020S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126861.32 MB22页237
IC封装资料_电源管理芯片_LTC3212EDDB_TRPBF.pdf
LTC32123212fbTypicalapplicaTionFeaTuresapplicaTionsDescripTionRGBLEDDriverandChargePumpTheLTC®3212isalownoisechargepumpRGBLEDdriv...
2024-12-12964867.93 KB12页237
IC封装资料_电源管理芯片_LTC3780IUH_TRPBF.pdf
LTC37801RevGFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighEfficiency,Synchr...
2024-12-1267452.33 KB30页237
IC封装资料_电容_CC1210KKX7R8BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124101.22 MB13页237
IC封装资料_电感_SWPA4030S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219381.32 MB22页237
IC封装资料_电源管理芯片_LT3014IDD_TRPBF.pdf
LT301413014fdTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION20mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3014isahighvol...
2024-12-12364266.84 KB16页237
IC封装资料_电容_CC0805CRNPO9BN1R8.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12955998.46 KB11页237
IC封装资料_电容_0603B225K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121221.05 MB27页237

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