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IC封装资料_电容_0603CG250J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123811.05 MB27页286
IC封装资料_电容_CC1206KRX7R0BB681.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121907998.46 KB11页286
IC封装资料_电感_SLF7045T-102MR14-PF.pdf
INDUCTORSApril2016��SLF7045��SLF7045�SLF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/indu...
2024-12-12498349.32 KB9页286
IC封装资料_电源管理芯片_LTC2955ITS8-2_TRMPBF.pdf
LTC295512955faFormoreinformationwww.linear.com/LTC2955LT3008-3.3VOUTVINPBONINTKILLPGDVINSELLTC2955DDB-12955TA01aGNDTMREN3.3V1MR71M...
2024-12-12813374.33 KB22页286
IC封装资料_电感_SWPA6040S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128971.32 MB22页286
IC封装资料_电源管理芯片_LTC3895IFE_PBF.pdf
LTC389513895faFormoreinformationwww.linear.com/LTC3895TypicalapplicaTionFeaTuresDescripTion150VLowIQ,SynchronousStep-DownDC/DCCont...
2024-12-1214342.24 MB38页286
IC封装资料_电容_CL10C330FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121655259.58 KB3页286
IC封装资料_电容_C823D822J60Q350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-129722.9 MB5页286
IC封装资料_电源管理芯片_LTM8020EV_PBF.pdf
LTM802018020feFormoreinformationwww.linear.com/LTM8020TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION200mA,36VDC/DCµModuleRegul...
2024-12-12979481.43 KB16页286
IC封装资料_电容_CL10B104MO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121452259.58 KB3页286
IC封装资料_连接器_1759033.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12175236.13 MB445页286
IC封装资料_电容_GRM1885C1H5R1BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12570944.07 KB30页286
IC封装资料_电容_CL10B201KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B201KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121614361.44 KB3页286
IC封装资料_电容_CL10B333KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B333KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,33㎋,50V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-127235.82 MB36页286
IC封装资料_电容_GRM188R61C106MAALD.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121930944.07 KB30页286
IC封装资料_电感_YPRH1204-330M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12100735.47 KB5页286
IC封装资料_电感_YPRH1209-681M.pdf
SMDPowerInductors-YPRH1209Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-1268736.23 KB5页286
IC封装资料_电容_TAJB334M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12875210.32 KB7页286
IC封装资料_电容_TAJC686M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12512210.32 KB7页286
IC封装资料_电容_TAJD158K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12151210.32 KB7页286

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