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IC资料

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IC封装资料_电容_GRM155R60J475ME47D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12251920.26 KB29页28
IC封装资料_电容_CL10A226MR8NQNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A226MR8NQNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218861.48 MB36页99
IC封装资料_电容_0805B333K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210371.26 MB20页87
IC封装资料_电感_SWPA8040S3R9NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129001.32 MB22页187
IC封装资料_电阻_4D02WGJ0514TCE.pdf
DATASHEETProductNameChipResistorsArrayPartName2F01/4F01/2C02/4C02/4C03/2D02/2D03/4D02/4DP3/16P8SeriesUniroyalElectronicsGlobalCo.,...
2024-12-121782993.9 KB9页23
IC封装资料_电源管理芯片_LTC4061EDD_TRPBF.pdf
LTC40614061fdTypicalapplicaTionFeaTuresDescripTionStandaloneLinearLi-IonBatteryChargerwithThermistorInputTheLTC®4061isafull-featu...
2024-12-12780356.89 KB20页174
IC封装资料_电子开关_SN080104RSER.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122872.65 MB30页153
IC封装资料_电源管理芯片_LTC4062EDD_TRPBF.pdf
LTC406214062fb■ChargeCurrentProgrammableUpto1A■ChargesSingle-CellLi-IonBatteriesDirectlyfromUSBPort■PresetFloatVoltagewith±0.3...
2024-12-121480263.04 KB20页253
IC封装资料_电容_CL10A335MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A335MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121511.42 MB36页105
IC封装资料_电容_GRM1555C1H101FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121763920.26 KB29页293
IC封装资料_电容_GRM1555C1H100JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12488920.26 KB29页87
IC封装资料_电容_CL10A335KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12725259.58 KB3页84
IC封装资料_电容_CL10C332JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121473259.58 KB3页268
IC封装资料_电容_0805B333K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215391.26 MB20页151
IC封装资料_电容_CL10C332JB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12287259.58 KB3页176
IC封装资料_电容_CL10C332JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121995316.41 KB3页231
IC封装资料_电感_SWPA8040S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210841.32 MB22页288
IC封装资料_电容_CL10C331JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121049259.57 KB3页273
IC封装资料_电源管理芯片_LTC4065EDC_TRPBF.pdf
1LTC4065/LTC4065A4065fb■WirelessPDAs■CellularPhones■PortableElectronicsStandalone750mALi-IonBatteryChargerin2×2DFN■CompleteLi...
2024-12-121427292.13 KB16页118
IC封装资料_电容_C0603NP0180JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1217471.92 MB48页47

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