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IC资料

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IC封装资料_电容_CL21B104MBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128261.45 MB36页223
IC封装资料_电容_CL10B105KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12740259.58 KB3页271
IC封装资料_电容_GRM1885C1H6R8CA01D.pdf
GRM1885C1H6R8CA01_(0603,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12416944.09 KB30页194
IC封装资料_电容_CL21B105KAFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1218027.46 MB84页159
IC封装资料_电容_0805CG271J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213281.05 MB27页147
IC封装资料_电感_YNR4018-680M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12222661.38 KB5页33
IC封装资料_电容_GRM1885C1H7R0BA01D.pdf
GRM1885C1H7R0BA01_(0603,C0G:EIA,7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121578944.09 KB30页256
IC封装资料_电感_YNR4018-470M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12745661.38 KB5页11
IC封装资料_电容_GRM1885C1H6R8DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121672944.07 KB30页234
IC封装资料_电容_GRM1885C1H7R0DA01D.pdf
GRM1885C1H7R0DA01_(0603,C0G:EIA,7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121569944.09 KB30页115
IC封装资料_电源管理芯片_MAX40200AUK+T.pdf
GeneralDescriptionTheMAX40200isanidealdiodecurrent-switchthatdropssolittlevoltagethatitapproachesanorderofmagnitudebetterthanSchot...
2024-12-121845646.27 KB14页99
IC封装资料_电容_GRM1885C1H7R0CA01D.pdf
GRM1885C1H7R0CA01_(0603,C0G:EIA,7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1261944.09 KB30页226
IC封装资料_电容_GRM155R71C563KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121324920.26 KB29页57
IC封装资料_电容_CL21B105KOFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KOFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-12159456.17 KB3页118
IC封装资料_电容_CL21B105KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-124521.45 MB36页61
IC封装资料_电容_CL10B105KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125741.45 MB36页192
IC封装资料_电容_CL21B105KBFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-126131.45 MB36页173
IC封装资料_电容_0805CG300J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125791.05 MB27页258
IC封装资料_电容_GRM1885C1H7R5CA01D.pdf
GRM1885C1H7R5CA01_(0603,C0G:EIA,7.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121619944.11 KB30页137
IC封装资料_电容_CL21B106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1212441.42 MB36页84

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