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IC资料

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IC封装资料_电容_CL10B123KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121318361.46 KB3页89
IC封装资料_电容_CL10B123KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121376361.46 KB3页229
IC封装资料_电容_0805CG500J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128641.05 MB27页273
IC封装资料_电感_YNR4030-680M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121888664.95 KB5页106
IC封装资料_电容_GRM1885C1H100JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121960944.07 KB30页297
IC封装资料_连接器_1759059.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12148136.13 MB445页71
IC封装资料_电容_CL21B333KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125851.45 MB36页237
IC封装资料_电容_CL21B332KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213361.45 MB36页132
IC封装资料_电容_GRM1885C1H101JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121594944.07 KB30页56
IC封装资料_电容_GRM1885C1H101GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12480944.07 KB30页99
IC封装资料_电容_CL21B334KBFNFNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12877.46 MB84页62
IC封装资料_电容_GRM1885C1H102FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121931944.07 KB30页102
IC封装资料_电容_CL21B334KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B334KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213291.45 MB36页152
IC封装资料_电容_GRM1885C1H102GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12808944.07 KB30页129
IC封装资料_电容_CL21B391KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213681.45 MB36页1
IC封装资料_电容_CC0402CRNPO9BN4R7.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12117617.81 MB176页270
IC封装资料_电源管理芯片_MCP1700T-3302E_TT.pdf
2005-2018MicrochipTechnologyInc.DS20001826E-page1MCP1700Features•AEC-Q100QualifiedandPPAPCapable•1.6µATypicalQuiescentCurrent...
2024-12-1218891.33 MB30页230
IC封装资料_电源管理芯片_MCP120T-315I_TT.pdf
2001MicrochipTechnologyInc.DS11184D-page1MCP120/130FEATURES•Holdsmicrocontrollerinresetuntilsupplyvoltagereachesstableoperating...
2024-12-12749316.43 KB16页3
IC封装资料_电容_GRM155R71E222KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12117920.26 KB29页217
IC封装资料_电容_GRM1885C1H102JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121959944.07 KB30页268

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