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IC资料

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IC封装资料_电源管理芯片_SPX1117M3-L-3-3TR.pdf
SSPPXX11111177880000mmAALLoowwDDrrooppoouuttVVoollttaaggeeRReegguullaattoorrSeptember2018Rev.2.1.11/11Rev.2.1.1GENERALDESCRIPTIONT...
2024-12-121680880.19 KB11页137
IC封装资料_电容_ERK2GM100F11OT.pdf
|A川川I~'jI~.~盯ROLYTICCAPACITORSAiSH~PartNumberingSystem日E回8:liJ囚lli囚~回113114国回①Category∞deCodeTypeEle恼。IyticCspacitor...
2024-12-129754.6 MB8页31
IC封装资料_电容_GRM188R71A224JA01D.pdf
GRM188R71A224JA01_(0603,X7R:EIA,0.22uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12419962.24 KB30页282
IC封装资料_连接器_DF12_3.0_-10DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12513288.67 KB11页279
IC封装资料_电容_CL10B473KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1254259.58 KB3页239
IC封装资料_连接器_DF9-25S-1V_69_.pdf
HRSDRAWINGFORREFERENCEApr.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-12190475.46 KB2页20
IC封装资料_电感_YP1005-3R3M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121473776.32 KB5页127
IC封装资料_连接器_DF3A-15P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121210222.32 KB1页126
IC封装资料_电源管理芯片_SPX1587AT-L-3-3_TR.pdf
SSPPXX1155887733AALLoowwDDrrooppoouuttVVoollttaaggeeRReegguullaattoorrSeptember2010Rev.2.0.0ExarCorporationwww.exar.com48720KatoRo...
2024-12-121559709.67 KB11页190
IC封装资料_连接器_DF3A-14P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121079222.32 KB1页234
IC封装资料_连接器_DF3A-13P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121763222.32 KB1页176
IC封装资料_电容_GRM188R71A224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12364944.07 KB30页220
IC封装资料_连接器_DF3A-12P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121075222.32 KB1页214
IC封装资料_电容_RVT1H101M0810-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1216541.08 MB3页50
IC封装资料_电容_CL10B473KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121540452.9 KB21页262
IC封装资料_连接器_DF12A-32DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121146288.67 KB11页13
IC封装资料_电容_CL10B473KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12301361.35 KB3页284
IC封装资料_连接器_DF12A-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12643288.67 KB11页241
IC封装资料_电容_CL10B473KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12348361.37 KB3页25
IC封装资料_连接器_DF12A-20DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12617288.67 KB11页30

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