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IC资料

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IC封装资料_电容_GRM188R72D102KW07D.pdf
GRM188R72D102KW07_(0603,X7R:EIA,1000pF,DC200V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121448800.86 KB25页151
IC封装资料_逻辑及时序器件_MC74HC32ADG.pdf
©SemiconductorComponentsIndustries,LLC,2014August,2014−Rev.121PublicationOrderNumber:MC74HC32A/DMC74HC32AQuad2-InputORGateHigh−...
2024-12-1271184.22 KB7页107
IC封装资料_电感_YSPI0530-150M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12894698.99 KB4页198
IC封装资料_逻辑及时序器件_74LVC1G240DCKRE4.pdf
Seemechanicaldrawingsfordimensions.DBVPACKAGE(TOPVIEW)51VCCOE2A34GNDYDCKPACKAGE(TOPVIEW)2A34GNDVCC5OEY1YZPPACKAGE(BOTTOMVIEW)2AVCC...
2024-12-125362.2 MB29页154
IC封装资料_电源管理芯片_TPS3828-33DBVRG4.pdf
−401.00110.9990.998−151035TA−Free-AirTemperature−C°0.9970.9960.9956085NormalizedInputThresholdVoltage−VIT(TA),VIT(25C)°VDDV...
2024-12-1211351.14 MB29页235
IC封装资料_电容_TAJB107K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12234210.32 KB7页35
IC封装资料_电容_TAJB107K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12944210.32 KB7页285
IC封装资料_电容_GRM188R72D471KW07D.pdf
GRM188R72D471KW07_(0603,X7R:EIA,470pF,DC200V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12638800.86 KB25页35
IC封装资料_电容_TAJB107K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121408210.32 KB7页124
IC封装资料_逻辑及时序器件_NCN5121MNTWG.pdf
©SemiconductorComponentsIndustries,LLC,2015October,2015−Rev.01PublicationOrderNumber:NCN5121/DNCN5121TransceiverforKNXTwistedPai...
2024-12-1210481.47 MB57页276
IC封装资料_电容_CL10C4R7CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121470316.22 KB3页14
IC封装资料_电容_TAJB107M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121595210.32 KB7页228
IC封装资料_电容_CL10C4R7CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页198
IC封装资料_电容_TAJB107M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121271210.32 KB7页45
IC封装资料_电容_CL10C4R7BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121320316.22 KB3页194
IC封装资料_电容_TAJB107M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121821210.32 KB7页113
IC封装资料_电容_GCJ188R72A152KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214474.17 MB96页224
IC封装资料_电容_1206X226M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219061.05 MB27页215
IC封装资料_电感_YSPI0530-220M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121489698.99 KB4页164
IC封装资料_逻辑及时序器件_SN74AC244DWR.pdf
SN54AC244,SN74AC244OCTALBUFFERS/DRIVERSWITH3-STATEOUTPUTSSCAS514E−JUNE1995−REVISEDOCTOBER20031POSTOFFICEBOX655303•DALLAS,TEXAS7...
2024-12-124621.56 MB24页6

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