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IC资料

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IC封装资料_电源管理芯片_LTC1148CS-3.3_TRPBF.pdf
1LTC1148LTC1148-3.3/LTC1148-5114835fdHighEfficiencySynchronousStep-DownSwitchingRegulatorsLOADCURRENT(A)0.0280EFFICIENCY(%)8590100...
2024-12-12938325.35 KB20页295
IC封装资料_电容_CC1812KKX7RCBB472.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12277998.46 KB11页295
IC封装资料_电容_CL10C751JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12971452.9 KB21页295
IC封装资料_晶振_9HT10.pdf
ElectricalSpecificationsEquivalentSeriesResistance(ESR)FeaturesDimensionsQuartzCrystalsSMDTUNINGFORK9HT10Units:mmNorminalFrequency...
2024-12-1290309.46 KB1页295
IC封装资料_电容_CC0201CRNPO9BN2R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1213331.22 MB13页295
IC封装资料_连接器_1827965.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12158736.19 MB445页295
IC封装资料_电容_CC0201JRNPO9BN220.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128481.22 MB13页295
IC封装资料_连接器_1759020.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1284136.13 MB445页295
IC封装资料_电容_GRM1885C1H820JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12375944.07 KB30页295
IC封装资料_电容_CL10B224KA8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KA8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216341.45 MB36页295
IC封装资料_电源管理芯片_REF3212AIDBVR.pdf
1GND_FGND_S32ENABLE564OUT_SINOUT_FREF3212REF3220REF3225REF3230REF3233REF3240REF3212,REF3220REF3225,REF3230REF3233,REF3240www.ti.co...
2024-12-1212331.07 MB22页295
IC封装资料_连接器_AFC11-S37ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-126831.4 MB10页295
IC封装资料_连接器_F0502-B-20-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12230290.85 KB1页295
IC封装资料_电容_T491C107K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-121681.54 MB23页295
IC封装资料_连接器_KF120-2.54-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121943686.3 KB1页295
IC封装资料_连接器_KF170V-5.0-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121254207.6 KB1页295
IC封装资料_电容_TAJA335K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12143210.32 KB7页295
IC封装资料_电容_TAJD686M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12957208.62 KB7页295
IC封装资料_电容_CL10C100DB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12261340.04 KB3页295
IC封装资料_电容_TAJV337M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121420210.31 KB7页295

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