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IC资料

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IC封装资料_连接器_FH28-10S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12899492.73 KB12页242
IC封装资料_电容_GCM21BR71E225KA73L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1211315.94 MB73页242
IC封装资料_电容_T491D477K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126041.54 MB23页242
IC封装资料_连接器_M55-6011242R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121833318.48 KB3页242
IC封装资料_信号隔离芯片_FOD2712R2.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121390670.43 KB14页241
IC封装资料_电容_0805F475Z160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126401.26 MB20页241
IC封装资料_连接器_A2541HWV-21P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12437814.91 KB16页241
IC封装资料_三极管_STD25N10F7.pdf
Thisisinformationonaproductinfullproduction.September2013DocID025265Rev11/21STD25N10F7,STF25N10F7,STP25N10F7N-channel100V,0.027Ωt...
2024-12-1212571.35 MB21页241
IC封装资料_电容_GRM188C81E475KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121298944.07 KB30页241
IC封装资料_三极管_IXTP1N120P.pdf
©2007IXYSCORPORATION,AllrightsreservedSymbolTestConditionsMaximumRatingsVDSSTJ=25°Cto150°C1200VVDGRTJ=25°Cto150°C,RGS=1MΩ120...
2024-12-121496227.43 KB4页241
IC封装资料_电感_YP0403-102M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121109776.45 KB5页241
IC封装资料_连接器_AFC01-S43FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-121661.85 MB10页241
IC封装资料_连接器_1759130.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12174336.13 MB445页241
IC封装资料_电容_LMK063BJ224MP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12323653.27 KB26页241
IC封装资料_电源管理芯片_RT9013-18GB.pdf
RT90131DS9013-10April2011www.richtek.comPinConfigurationsApplications�CDMA/GSMCellularHandsets�PortableInformationAppliances�La...
2024-12-12357384.76 KB13页241
IC封装资料_连接器_BM28B0.6-58DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121906562.52 KB8页241
IC封装资料_电容_AC0805JRNPO9BN470.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-12841.06 MB24页241
IC封装资料_连接器_DF12A-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12642288.67 KB11页241
IC封装资料_电容_1206CG3R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129341.05 MB27页241
IC封装资料_电容_GCJ21BR71H474KA12L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218974.17 MB96页241

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