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IC资料

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IC封装资料_电容_CL10A225KP8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-123891.42 MB36页233
IC封装资料_电容_CL10A106MR5LQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121326259.58 KB3页233
IC封装资料_电容_0805B182K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126091.05 MB27页233
IC封装资料_连接器_1757336.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1266136.13 MB445页233
IC封装资料_电容_GRM32ER71H106KA12L.pdf
GRM32ER71H106KA12_(1210,X7R:EIA,10uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121543964.39 KB30页233
IC封装资料_电源管理芯片_LT3060EDC-3.3_TRMPBF.pdf
LT3060Series13060fcFormoreinformationwww.linear.com/LT3060TypicalapplicaTionDescripTion45VVIN,Micropower,LowNoise,100mALowDropout,...
2024-12-121410515.79 KB26页233
IC封装资料_电容_GCM1885C1H200JA16D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1211133.23 MB2页233
IC封装资料_电源管理芯片_LT1963AEQ_PBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12174629.18 KB28页233
IC封装资料_电源管理芯片_LT1947EMS_TRPBF.pdf
LT194711947fa■TFT-LCDNotebookDisplayPanels■TFT-LCDDesktopMonitorDisplayPanels■DigitalCameras■HandheldComputers■CompleteSoluti...
2024-12-121388271.91 KB12页233
IC封装资料_电容_GCM1555C1H300JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1218965.94 MB73页233
IC封装资料_电感_MLG1005S4N7ST000.pdf
February2017INDUCTORSMultilayerCeramicMLG1005S1005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLG1005STypeM...
2024-12-12546418.81 KB16页233
IC封装资料_电源管理芯片_LT1021BCN8-5_PBF.pdf
1LT10211021fcAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOUPrecisionReferenceTypicalDistributionofTemperatureDriftOUTPUTDRIFT(p...
2024-12-121159306.35 KB16页233
IC封装资料_电容_CC0805JRNPOABN221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-129121.22 MB13页233
IC封装资料_电容_0402B104K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125431.05 MB27页233
IC封装资料_电容_0201CG3R3B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217781.05 MB27页233
IC封装资料_电感_BRC2012T2R2MD.pdf
20REMINDERSNoticeforTAIYOYUDENproductsPleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.■ProductInformationinthisCatalogProduc...
2024-12-12665690.62 KB12页233
IC封装资料_电感_YSPI1040-100M.pdf
SMDPowerInductors-YSPI1040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121303702.46 KB5页233
IC资料_HLS27DWB1130C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151593673.17 KB8页233
IC封装资料_信号隔离芯片_FOD2712.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121402670.43 KB14页233
IC封装资料_电源管理芯片_XC6701B502MR-G.pdf
1/35XC6701Series28VOperationHighSpeedVoltageRegulatorswithStand-byFunction■FEATURESMaxOutputCurrent:Morethan150mA(200mAlimit)(VIN...
2024-12-12964753.36 KB35页233

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