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IC资料

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IC封装资料_电容_GCM188R71E103KA37D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1213025.94 MB73页212
IC封装资料_电感_LQP03TN5N6J02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12944281.03 KB12页212
IC封装资料_电容_UMK105CG2R7CV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121293653.27 KB26页212
IC封装资料_电容_UMK105CG5R6CV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12804653.27 KB26页212
IC封装资料_电感_CI160808-R10J.pdf
CI160808Series-Multi-LayerChipInductorsBournsPartNo.InductanceQTestFreq.SRFMHzDCRIrmsnHTol.%min.L,QMHzmin.typ.ohmmax.mAmax.CI16080...
2024-12-12178325.52 KB3页212
IC封装资料_连接器_1803471.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12118136.13 MB445页212
IC封装资料_电容_CL10C151JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1218891.42 MB36页212
IC封装资料_三极管_BSS169H6327XTSA1.pdf
BSS169SIPMOS®Small-Signal-TransistorFeatures•N-channel•Depletionmode•dv/dtrated•AvailablewithVGS(th)indicatoronreel•Pb-freel...
2024-12-12628509.07 KB9页212
IC封装资料_电感_YSPI0730-R68M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121632702.26 KB5页212
IC封装资料_电容_TAJB155K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12263210.32 KB7页212
IC封装资料_电容_TAJA475M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121697210.32 KB7页212
IC封装资料_电容_CL10B563KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12603259.58 KB3页212
IC封装资料_连接器_BM28B0.6-60DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12820562.52 KB8页212
IC封装资料_电容_ECA-1HM221.pdf
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2024-12-121326281.34 KB6页212
IC封装资料_电感_YP0301-330M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121985719.3 KB5页212
IC封装资料_电容_TAJV156K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121607210.32 KB7页211
IC封装资料_连接器_1803390.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1293036.13 MB445页211
IC封装资料_电容_TAJC106M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12762210.32 KB7页211
IC封装资料_电感_YSPI0740-2R2M.pdf
SMDPowerInductors-YSPI0740Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121453696.56 KB4页211
IC封装资料_连接器_FH28-45S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-121044492.73 KB12页211

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