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IC资料

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IC封装资料_电容_CL10C180JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12692259.58 KB3页207
IC封装资料_电容_CL10C180JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210971.42 MB36页207
IC封装资料_三极管_CSD88539ND.pdf
0612182430364248546002468101214161820VGS-Gate-to-SourceVoltage(V)RDS(on)-On-StateResistance(mΩ)TC=25°C,ID=5ATC=125°C,ID=5AG0010...
2024-12-1210581.02 MB13页207
IC封装资料_电容_1812B105K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121071.05 MB27页207
IC封装资料_电容_TAJC107K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12237210.32 KB7页207
IC封装资料_电容_GCJ32QR72J103KXJ1L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212074.17 MB96页207
IC封装资料_连接器_KF2EDGCV-X-5.08-16P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121918627.15 KB1页207
IC封装资料_电容_CL10B473KO8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12307452.9 KB21页207
IC封装资料_连接器_AFC01-S55FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-123901.85 MB10页207
IC封装资料_电容_GRM155R71H473KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12906920.26 KB29页207
IC封装资料_连接器_5179031-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12775157.59 KB2页207
IC封装资料_连接器_1881626.pdf
https://www.phoenixcontact.com/us/produkte/188162603.10.2012Page1/5Basestrip-MCV0.5/9-G-2.5-1881626Pleasebeinformedthatthedatashow...
2024-12-12527171.76 KB5页207
IC封装资料_电容_GRM155R71H102KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12411920.26 KB29页207
IC封装资料_电容_GRM1885C1H181JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12601944.07 KB30页207
IC封装资料_电容_CL10C910JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1273259.58 KB3页207
IC封装资料_电容_0805B682K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127341.26 MB20页207
IC封装资料_电源管理芯片_LTC4081EDD_PBF.pdf
LTC408114081faFormoreinformationwww.linear.com/LTC4081TYPICALAPPLICATIONFEATURESDESCRIPTION500mALi-IonChargerwithNTCInputand300mAS...
2024-12-12410545.44 KB24页207
IC封装资料_电容_CL10A225KA5LNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121290259.58 KB3页207
IC封装资料_电源管理芯片_LTC3025EDC-1_TRMPBF.pdf
LTC3025-1/LTC3025-2/LTC3025-3/LTC3025-4130251234ffTypicalapplicaTionFeaTuresapplicaTionsDescripTion500mAMicropowerVLDOLinearRegula...
2024-12-12531333.78 KB14页207
IC封装资料_电容_GMK107BJ105KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121135857.12 KB55页207

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