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IC封装资料_电容_CL32B106KAULNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32B106KAULNNE·Product:Multi-layerCeramicCapacitor...
2024-12-129691.47 MB36页198
IC封装资料_电容_CL21C3R9CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210741.39 MB36页198
IC封装资料_电感_YNR3015-6R8M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121093665.41 KB5页198
IC封装资料_电容_CL10B104KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12211259.58 KB3页198
IC封装资料_电容_CC0201CRNPO9BN2R7.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121139998.46 KB11页198
IC封装资料_电源管理芯片_LTC4412HVIS6_TRMPBF.pdf
1LTC4412HVsn4412hv4412hvfsAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU36V,LowLossPowerPathTMControllerinThinSOTIVeryLowLossRe...
2024-12-121808260.58 KB12页198
IC封装资料_电容_C1608X5R1C105K080AA.pdf
June2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA10603[0201inch]CGA21005[0402inch]CGA31608[0603inch]CGA420...
2024-12-12274979.73 KB23页198
IC封装资料_电容_0603N680J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216261.26 MB20页198
IC封装资料_电容_CC1206KRX7RABB561.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12605998.46 KB11页198
IC封装资料_电容_0603F105M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12721.05 MB27页198
IC封装资料_电容_0805B101K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-121831.26 MB20页198
IC封装资料_电容_CC1206KKX7RZBB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126631.22 MB13页198
IC封装资料_电源管理芯片_LT3650EDD-8.4_TRPBF.pdf
LT3650-8.2/LT3650-8.4136508284fdTypicalapplicaTionTheLT®3650isacompletemonolithic2-cellLi-Ion/Polymerbatterychargerthatoperatesov...
2024-12-121890362.48 KB22页198
IC封装资料_电容_CC1206KKX7R8BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216421.22 MB13页198
IC封装资料_电源管理芯片_LT3021ES8-1.2_PBF.pdf
LT3021/LT3021-1.2/LT3021-1.5/LT3021-1.813021fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION500mA,LowVoltage,VeryLowDropoutLine...
2024-12-121217272.6 KB16页198
IC封装资料_电感_NL453232T-102J-PF.pdf
INDUCTORSJanuary2015��NL4532324532[1812inch]**��JIS[EIA]��NL453232�NL��更多资料下载请到五八文...
2024-12-121564309.28 KB9页198
IC封装资料_电感_MLZ1608N100LT000.pdf
May2017INDUCTORSMultilayerFerriteMLZ16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforDecouplingCircuitsMLZ1608TypeMLZSeries更...
2024-12-12296335.39 KB10页198
IC封装资料_电容_GRM1885C1H130GA01D.pdf
GRM1885C1H130GA01_(0603,C0G:EIA,13pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121509944.08 KB30页197
IC封装资料_电容_GRM1555C2A9R0BA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comForapplicationsthatdonotrequir...
2024-12-1211464.37 MB90页197
IC封装资料_电容_GRM1555C1H241JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121764920.26 KB29页197

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