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IC资料

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IC封装资料_电容_CL10B222KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121265259.58 KB3页189
IC封装资料_电容_GRM1885C1H150GA01D.pdf
GRM1885C1H150GA01_(0603,C0G:EIA,15pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121292944.09 KB30页189
IC封装资料_电容_CL21B471KCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121491.45 MB36页189
IC封装资料_连接器_1830651.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1253536.13 MB445页189
IC封装资料_连接器_3-1634218-2.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12189388.05 KB2页189
IC封装资料_电容_C1206C104K3RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-126311.48 MB25页189
IC封装资料_电容_CL10C300JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12925316.29 KB3页189
IC封装资料_电源管理芯片_LTC3130EMSE_TRPBF.pdf
LTC3130/LTC3130-113130fFormoreinformationwww.linear.com/LTC3130TYPICALAPPLICATIONFEATURESDESCRIPTION25V,600mABuck-BoostDC/DCConver...
2024-12-121744.78 MB38页189
IC封装资料_电源管理芯片_LTC3624IDD_PBF.pdf
LTC3624/LTC3624-2136242fdFormoreinformationwww.linear.com/LTC3624TypicalapplicaTionFeaTuresDescripTion17V,2ASynchronousStep-DownRe...
2024-12-121413403.66 KB20页189
IC封装资料_电感_SWPA4030S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210631.32 MB22页189
IC封装资料_电源管理芯片_LTC3568EDD_TRPBF.pdf
LTC35683568faTypicalapplicaTionFeaTuresapplicaTionsDescripTion1.8A,4MHz,SynchronousStep-DownDC/DCConverterTheLTC®3568isaconstantf...
2024-12-12147389.09 KB18页189
IC封装资料_电容_CC1206KRX7R9BB223.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211251.22 MB13页189
IC封装资料_电容_0603CG681J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210001.05 MB27页189
IC封装资料_电容_CL03C120JA3GNNC.pdf
2.Description3.FrequencycharacteristicsNetworkAnalyzerN5230,100MHzto20GHzVoltage(V)25MultiLayerCeramicCapacitor(MLCC)1.Model:CL03C...
2024-12-12905149.4 KB1页189
IC封装资料_电容_CC1206KKX5R8BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211061.22 MB13页189
IC封装资料_电感_NLCV32T-3R3M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121924249.79 KB16页189
IC封装资料_电容_0603CG4R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122831.05 MB27页189
IC封装资料_电源管理芯片_LT3461AES6_TRPBF.pdf
LT3461/LT3461A13461afaFormoreinformationwww.linear.com/LT3461TYPICALAPPLICATIONFEATURESDESCRIPTION1.3MHz/3MHzStep-UpDC/DCConverter...
2024-12-121266615.59 KB10页189
IC封装资料_电容_CC0805CRNPO9BN1R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-1268998.46 KB11页189
IC封装资料_连接器_1755833.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1223036.13 MB445页189

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