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IC资料

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IC封装资料_数据转换器_AD5668BRUZ-1.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1217851.04 MB30页168
IC封装资料_电容_CL10C270JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C270JB81PNC●Product:Multi-layerCeramicCapacitorCAP,27㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-1218725.8 MB36页168
IC封装资料_电容_TAJE108M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121764210.32 KB7页168
IC封装资料_电容_TAJD336M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121541208.62 KB7页168
IC封装资料_电容_TAJD156K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12886210.32 KB7页168
IC封装资料_电容_GCM21BC71E475KE36L.pdf
GCM21BC71E475KE36_(0805,X7S:EIA,4.7uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-1254936.59 KB29页168
IC封装资料_电容_GCJ219R71H334KA12D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214135.94 MB73页168
IC封装资料_电感_YSPI0724-1R5M.pdf
SMDPowerInductors-YSPI0724Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12807698.31 KB4页168
IC封装资料_电容_CL10B823KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B823KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12868361.38 KB3页168
IC封装资料_电容_CL10B823KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B823KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12810361.45 KB3页168
IC封装资料_电容_CL10B682KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121965452.9 KB21页168
IC封装资料_电容_CL10B682KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12147259.58 KB3页168
IC封装资料_电容_1206CG6R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210481.05 MB27页168
IC封装资料_电容_GRM188R71C154KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121075944.07 KB30页168
IC封装资料_连接器_AFC11-S42ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-12691.4 MB10页168
IC封装资料_电容_LDK063ABJ105MP-F.pdf
Thedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAIYOYUDENreservestherighttomakec...
2024-12-12539402.72 KB2页168
IC封装资料_电容_CL10B333KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12945259.58 KB3页168
IC封装资料_电容_JMK105BJ225KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12708653.27 KB26页168
IC封装资料_连接器_AFC01-S26FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210171.85 MB10页168
IC封装资料_电容_DE1E3KX222MN4AN01F.pdf
LeadTypeDiscCeramicCapacitors(SafetyStandardCertified)ResinMoldingSMDTypeCeramicCapacitors(SafetyStandardCertified)C85E.pdfSep.14,...
2024-12-124421.8 MB73页168

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