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IC资料

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IC封装资料_电容_GRM1885C2A200JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121664944.07 KB30页165
IC封装资料_电容_GRM1885C2A120GA01D.pdf
GRM1885C2A120GA01_(0603,C0G:EIA,12pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12117943.98 KB30页165
IC封装资料_电容_GRM1885C1HR50CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12854944.07 KB30页165
IC封装资料_连接器_A0801AWR-15-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121243334.91 KB1页165
IC封装资料_电感_YNR6045-152M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121321672.55 KB6页165
IC封装资料_电容_GRM1885C1H5R6BA01D.pdf
GRM1885C1H5R6BA01_(0603,C0G:EIA,5.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12911944.09 KB30页165
IC封装资料_电容_CL10F474ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217401.42 MB36页165
IC封装资料_电容_GRM1555C1H511JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12662920.26 KB29页165
IC封装资料_电源管理芯片_LTC1998CS6_TRPBF.pdf
LTC199811998fbBLOCKDIAGRAMFEATURESAPPLICATIONSDESCRIPTION2.5µA,1%AccurateSOT-23ComparatorandVoltageReferenceforBatteryMonitoringT...
2024-12-12143218.88 KB12页165
IC封装资料_电容_0603F224Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125971.26 MB20页165
IC封装资料_电感_NLV32T-181J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12139325.01 KB6页165
IC封装资料_电源管理芯片_LT3032EDE_PBF.pdf
LT3032Series13032ffFormoreinformationwww.linear.com/LT3032TYPICALAPPLICATIONFEATURESDESCRIPTIONDual150mAPositive/NegativeLowNoiseL...
2024-12-12751485.16 KB24页165
IC封装资料_电感_NLV32T-039J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12715325.74 KB6页165
IC封装资料_电感_MWSA0603-1R0MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-12406319.07 KB8页165
IC封装资料_电源管理芯片_LT1764EQ_PBF.pdf
1LT1764Series1764fb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■DropoutVo...
2024-12-12568360.65 KB20页165
IC封装资料_电容_CC0805JRX7R9BB102.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216571.22 MB13页165
IC封装资料_电容_CL10B105KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121053259.58 KB3页164
IC封装资料_电容_CL03A105MP3NSNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-12601.42 MB36页164
IC封装资料_电感_SRN1060-101M.pdf
Features■Semi-shieldedconstruction■Highinductance■Inductancerange:10to470µH■Highratedcurrent-upto5.4A■RoHScompliant*andhalog...
2024-12-121621316.17 KB3页164
IC封装资料_电容_CC1206KRX7RABB471.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210761.22 MB13页164

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