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IC资料

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IC封装资料_电源管理芯片_LM317MKVURG3.pdf
INPUTADJUSTINPUTOUTPUTADJUSTOUTPUTOUTPUTKVU(TO-252)PACKAGE(TOPVIEW)OUTPUTINPUTADJUSTOUTPUTKTP(PFM)PACKAGE(TOPVIEW)DCY(SOT-223)PACK...
2024-12-121251.11 MB23页288
IC封装资料_电容_CL21A105KBCLNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A105KBCLNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215501.45 MB36页288
IC封装资料_电容_0603X684K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217401.26 MB20页287
IC封装资料_电容_CC0805JRNPO9BN250.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121091998.46 KB11页287
IC封装资料_电感_NLCV25T-R22M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121838249.79 KB16页287
IC封装资料_电容_CC1206JRNPO9BN121.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124401.22 MB13页287
IC封装资料_电容_0805B332K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213701.05 MB27页287
IC封装资料_连接器_1730188.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12149036.13 MB445页287
IC封装资料_电容_0805B471K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217081.26 MB20页287
IC封装资料_电感_MWSA0603-2R2MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-12335319.07 KB8页287
IC封装资料_电源管理芯片_LT1766EFE_TRPBF.pdf
LT1766/LT1766-511766fcTYPICALAPPLICATIONDESCRIPTION5.5Vto60V1.5A,200kHzStep-DownSwitchingRegulator5VBuckConverterFEATURESAPPLICATI...
2024-12-12249367.61 KB30页287
IC封装资料_电源管理芯片_LT1175IST-5_PBF.pdf
LT117511175ffTYPICALAPPLICATIONFEATURESDESCRIPTION500mANegativeLowDropoutMicropowerRegulatorTheLT®1175isanegativemicropowerlowdro...
2024-12-121500299.02 KB20页287
IC封装资料_电容_0805B562K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129721.05 MB27页287
IC封装资料_电容_0603B223K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124231.05 MB27页287
IC封装资料_电源管理芯片_LTC4416IMS_PBF.pdf
LTC4416/LTC4416-14416fa36V,LowLossDualPowerPathControllersforLargePFETsTheLTC®4416/LTC4416-1controltwosetsofexternalP-channelMOSF...
2024-12-121182296.71 KB12页287
IC封装资料_电容_0402CG3R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122551.05 MB27页287
IC封装资料_电容_GRM1555C1HR75CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121427920.26 KB29页287
IC封装资料_连接器_39FVXS-RSM1-GAN-TF.pdf
1FVXSCONNECTOR0.2mmpitch/ConnectorsforFPCEmbossTapeSpecifications–––––––––––––––––––•Currentrating:0.2AAC,DC•...
2024-12-121614153.49 KB2页287
IC封装资料_电感_LQG15HN10NJ02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12802273.56 KB11页287
IC封装资料_电容_UMK107B7474KA-TR.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121348857.12 KB55页287

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