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IC资料

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IC封装资料_电容_CL10B153KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12357259.58 KB3页153
IC封装资料_电容_GRM155R71C183KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121583920.26 KB29页153
IC封装资料_电容_0805CG7R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216271.05 MB27页153
IC封装资料_电容_GRM1555C1HR40BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121420920.26 KB29页153
IC封装资料_电阻_MF18W271T52.pdf
深圳市咸阳华星机电有限公司SHENZHENXIANYANGHUAXINGMACHINERG&ELECTRONIC.CO;LTD承认书（APPROVESHEET）客户(Customer):品名(Description)...
2024-12-12714645.68 KB13页153
IC封装资料_电子开关_SN080104RSER.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122872.65 MB30页153
IC封装资料_电源管理芯片_XL6019.pdf
Datasheet180KHz60V5A开关电流升压/升降压型DC-DC转换器XL6019Rev1.1www.xlsemi.com1特点�5V到40V宽输入电压范围�1.25V输出电压采样电压...
2024-12-121146528.97 KB13页153
IC封装资料_电感_SWPA3012S120MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213701.32 MB22页153
IC封装资料_电容_CL03C220JA3ANNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1215647.46 MB84页153
IC封装资料_电感_NLV32T-100J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121951325.01 KB6页153
IC封装资料_电源管理芯片_LT3014EDD_TRPBF.pdf
LT301413014fdTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION20mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3014isahighvol...
2024-12-12895266.84 KB16页153
IC封装资料_连接器_1730201.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1276736.13 MB445页153
IC封装资料_电容_0402CG750J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215431.05 MB27页153
IC封装资料_电感_NLV25T-R39J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-121295215.06 KB9页153
IC封装资料_电感_NLV25T-033J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12182316.78 KB6页153
IC封装资料_连接器_1730146.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12127936.13 MB445页153
IC封装资料_电容_CL21B334KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B334KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213291.45 MB36页152
IC封装资料_电容_CL21B153KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-129967.46 MB84页152
IC封装资料_电容_CL21A475KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A475KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-129331.42 MB36页152
IC封装资料_电容_GRM155R71A104KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121889920.26 KB29页152

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