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IC资料

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IC封装资料_三极管_DTC114EETL.pdf
DTC114EseriesNPN100mA50VDigitalTransistor(BiasResistorBuilt-inTransistor)DatasheetllOutlineParameterValueSOT-723SOT-416FLVCC50VIC(...
2024-12-1210132.39 MB12页151
IC封装资料_电源管理芯片_UCC28C43DR.pdf
VINUCC28C43VDDVREFRT/CTGNDCOMPFBCSOUTVOUTCopyright©2016,TexasInstrumentsIncorporatedProductFolderOrderNowTechnicalDocumentsTools&...
2024-12-1214273.88 MB55页151
IC封装资料_电容_CL10C7R5DB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121764316.21 KB3页151
IC封装资料_电容_TAJB225M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121035210.32 KB7页151
IC封装资料_电容_GRM188R72D102KW07D.pdf
GRM188R72D102KW07_(0603,X7R:EIA,1000pF,DC200V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121448800.86 KB25页151
IC封装资料_电容_GCJ188L81C333KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1213225.94 MB73页151
IC封装资料_电容_T491D476K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1215681.54 MB23页151
IC封装资料_电容_GRM188R71H104MA93D.pdf
GRM188R71H104MA93_(0603,X7R:EIA,0.1uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121293962.36 KB30页151
IC封装资料_电感_YPRH0704-331M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121416730.34 KB5页151
IC封装资料_电容_CL10B333KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12484452.9 KB21页151
IC封装资料_电容_CC0402KRX5R8BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12841.22 MB13页151
IC封装资料_电容_0805N300J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128731.26 MB20页151
IC封装资料_电容_GRM1885C1H470JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12926944.07 KB30页151
IC封装资料_电容_GRM1885C1H271JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121319944.07 KB30页151
IC封装资料_电源管理芯片_ME6209A18M3G.pdf
V12www.microne.com.cnPage1of14ME6209LowPowerConsumptionLDOME6209SeriesGeneralDescriptionFeaturesTypicalApplicationPackageCameras...
2024-12-121488957.58 KB14页151
IC封装资料_电容_C3216C0G1H104JT000N.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-1218231.79 MB37页151
IC封装资料_电容_0805B333K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215391.26 MB20页151
IC封装资料_电容_CL10C330JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121997316.28 KB3页151
IC封装资料_电源管理芯片_LTC3890IGN-1_TRPBF.pdf
LTC3890-1138901fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION60VLowIQ,Dual,2-PhaseSynchronousStep-DownDC/DCControllerHighEffi...
2024-12-121166955.88 KB36页151
IC封装资料_电源管理芯片_LTC3200EMS8_TRPBF.pdf
LTC3200/LTC3200-51APPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOUTheLTC®3200/LTC3200-5arelownoise,constantfre-quencyswitchedcap...
2024-12-12900263.11 KB12页151

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