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IC资料

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IC封装资料_电容_GRM1555C1H7R0CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12318920.26 KB29页133
IC封装资料_三极管_WSK220N04.pdf
BVDSSRDSONID40V2.5mΩ220A�AdvancedhighcelldensityTrenchtechnology�SuperLowGateCharge�ExcellentCdV/dteffectdecline�100%EASGuara...
2024-12-12414717.51 KB7页133
IC封装资料_三极管_TMC1340-SO.pdf
POWERMOSFETsFORSTEPPERMOTORSINTEGRATEDCIRCUITSTRINAMICMotionControlGmbH&Co.KGHamburg,GermanyTMC1340-SODATASHEETTMC262WITH4XTMC1340...
2024-12-1214261.73 MB12页133
IC封装资料_三极管_2N7002DWH6327XTSA1.pdf
2N7002DWOptiMOS™Small-Signal-TransistorFeatures•DualN-channel•Enhancementmode•Logiclevel•Avalancherated•Fastswitching•Quali...
2024-12-12577540.34 KB9页133
IC封装资料_连接器_SM13B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121413661.17 KB4页133
IC封装资料_电容_T491C107M010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125951.54 MB23页133
IC封装资料_连接器_DF12C-20DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12570288.67 KB11页133
IC封装资料_电容_GRM188R70J224KA88D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12188110.43 MB296页133
IC封装资料_连接器_AYF530435.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1211741.1 MB13页133
IC封装资料_电容_JMK212BJ226KG-T.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-126921.01 MB17页133
IC封装资料_电容_JMK105BBJ475MV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121981857.12 KB55页133
IC封装资料_电容_0805N4R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210971.26 MB20页133
IC封装资料_连接器_1935174.pdf
https://www.phoenixcontact.com/us/products/193517408/04/2015Page1/6PCBterminalblock-PT1,5/3-5,0-H-1935174Pleasebeinformedthattheda...
2024-12-121614172.22 KB6页133
IC封装资料_电源管理芯片_ME6118A12B3G.pdf
V10.0www.microne.com.cnPage1of17ME61181AAdjustableVoltageHighSpeedLDORegulatorsME6118SeriesGeneralDescriptionFeaturesTypicalApplic...
2024-12-121666746.33 KB17页133
IC封装资料_电容_GRM1885C1H2R5CA01D.pdf
GRM1885C1H2R5CA01_(0603,C0G:EIA,2.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121291944.09 KB30页133
IC封装资料_连接器_2-1734592-8.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121809247.85 KB3页133
IC封装资料_电容_CL21A106KQFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KQFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-124901.42 MB36页133
IC封装资料_电源管理芯片_LTC6803HG-4_PBF.pdf
LTC6803-2/LTC6803-41680324faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-121687486.53 KB40页133
IC封装资料_连接器_1827907.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12147136.13 MB445页133
IC封装资料_电容_GRM1555C1H270FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12627920.26 KB29页133

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