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IC资料

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IC封装资料_连接器_1843745.pdf
https://www.phoenixcontact.com/us/produkte/184374502.11.2012Page1/5Basestrip-MCV1,5/16-G-3,5-1843745Pleasebeinformedthatthedatasho...
2024-12-121510175.27 KB5页283
IC封装资料_电容_TAJA685M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121625210.32 KB7页283
IC封装资料_电容_1210B225K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128031.05 MB27页283
IC封装资料_电容_TAJD106M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121239210.32 KB7页283
IC封装资料_电源管理芯片_XL4013.pdf
Datasheet4A180KHz36VBuckDCtoDCConverterXL4013Rev1.3www.xlsemi.com1Features�Wide8Vto36VInputVoltageRange�OutputAdjustablefrom1.25...
2024-12-12623421.4 KB10页283
IC封装资料_电容_T491A106M006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1214031.54 MB23页283
IC封装资料_电容_CL31B475KBHNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B475KBHNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-1216931.47 MB36页283
IC封装资料_电容_GRM185R61C105KE44D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12719944.07 KB30页283
IC封装资料_电容_GRM1885C2A220JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121780944.07 KB30页283
IC封装资料_电源管理芯片_SG3525ADWR2G.pdf
�SemiconductorComponentsIndustries,LLC,2005January,2005−Rev.51PublicationOrderNumber:SG3525A/DSG3525APulseWidthModulatorControlC...
2024-12-121064231.96 KB10页283
IC封装资料_连接器_AYF333135.pdf
–1–ACCTB47E201803-TDETAILEDFEATURESForFPCY3B/Y3BWFPC/FFCconnectors(0.3mmpitch)BacklockSlim,pitch0.3mmanddoubletopandbottomcontac...
2024-12-1217671.35 MB14页283
IC封装资料_电源管理芯片_R1202L521A-TR.pdf
R1202xSeriesSTEP-UPDC/DCCONVERTERwithSHUTDOWNFUNCTIONNO.EA-255-1907251OUTLINETheR1202xSeriesareCMOS-basedPWMstep-upDC/DCconverterI...
2024-12-1218661.37 MB31页283
IC封装资料_三极管_DTC144EUAT106.pdf
DTC144EseriesNPN100mA50VDigitalTransistors(BiasResistorBuilt-inTransistors)DatasheetllOutlineParameterValueVMT3EMT3FVCC50VIC(MAX.)...
2024-12-1212081.56 MB11页283
IC封装资料_电感_SDCL1005C5N1STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121927376.19 KB4页283
IC封装资料_电源管理芯片_LT3748EMS_TRPBF.pdf
LT374813748fbFormoreinformationwww.linear.com/LT3748FeaturesapplicationsDescription100VIsolatedFlybackControllerTheLT®3748isaswit...
2024-12-121876609.73 KB34页283
IC封装资料_电感_NLV32T-680J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12550325.01 KB6页283
IC封装资料_电感_NLV32T-220J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121603325 KB6页283
IC封装资料_电源管理芯片_LTC3789EGN_TRPBF.pdf
LTC378913789fcFormoreinformationwww.linear.com/LTC3789TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Synchronous,...
2024-12-12315611.07 KB30页283
IC封装资料_电容_CL02A104MQ2NNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL02A104MQ2NNNCProduct:Multi-layerCeramicCapacitor...
2024-12-12266316.66 KB3页283
IC封装资料_电容_CC1206JKNPOCBN680.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125931.22 MB13页283

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