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IC资料

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IC封装资料_三极管_SI1308EDL-T1-GE3.pdf
Si1308EDLwww.vishay.comVishaySiliconixS14-1997-Rev.C,06-Oct-141DocumentNumber:63399Fortechnicalquestions,contact:pmostechsupport@v...
2024-12-121979346.69 KB11页111
IC封装资料_电源管理芯片_VIPER22ADIP-E.pdf
November2010DocID12050Rev21/2121VIPer22A-EVIPer22ADIP-E,VIPer22AS-ELowpowerOFF-lineSMPSprimaryswitcherFeatures■Fixed60kHzswitchin...
2024-12-121922489.71 KB21页111
IC封装资料_三极管_FDS4435BZ.pdf
©SemiconductorComponentsIndustries,LLC,2009August,2019−Rev.41PublicationOrderNumber:FDS4435BZ/DFDS4435BZMOSFET–P-Channel,POWERT...
2024-12-121467474.84 KB7页111
IC封装资料_三极管_DMP2160U-7.pdf
DMP2160UDocumentnumber:DS31586Rev.9-31of5www.diodes.comDecember2017©DiodesIncorporatedDMP2160UP-CHANNELENHANCEMENTMODEMOSFETProdu...
2024-12-12298573.39 KB5页111
IC封装资料_电容_CL10C120JB8NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1212407.55 MB84页111
IC封装资料_电容_TAJC686K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121119210.32 KB7页111
IC封装资料_连接器_SM05B-GHP-A-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121186661.11 KB4页111
IC封装资料_电容_1206CG271J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122861.05 MB27页111
IC封装资料_电容_GRM188R71H202KA01D.pdf
GRM188R71H202KA01_(0603,X7R:EIA,2000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121870962.46 KB30页111
IC封装资料_电容_GRM188R71H104KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121443944.07 KB30页111
IC封装资料_电源管理芯片_SPX1117M3-L-1-8_TR.pdf
SSPPXX11111177880000mmAALLoowwDDrrooppoouuttVVoollttaaggeeRReegguullaattoorrSeptember2018Rev.2.1.11/11Rev.2.1.1GENERALDESCRIPTIONT...
2024-12-121937880.19 KB11页111
IC封装资料_电容_CC0402KRX5R5BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128391.22 MB13页111
IC封装资料_电容_CL31A226KQHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A226KQHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-122271.48 MB36页111
IC封装资料_电容_GRM1885C1H120FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121870944.07 KB30页111
IC封装资料_电容_0805CG8R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210821.05 MB27页111
IC封装资料_电容_0805B681K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213761.26 MB20页111
IC封装资料_电容_GRM1555C1H151JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12932920.26 KB29页111
IC封装资料_电源管理芯片_LTC3405AES6-1.8_TRPBF.pdf
1LTC3405A-1.5/LTC3405A-1.83405a1518fa■HighEfficiency:Upto93%■VeryLowQuiescentCurrent:Only20µADuringOperation■300mAOutputCurren...
2024-12-121358287.5 KB16页111
IC封装资料_电容_0603N5R6C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123861.26 MB20页111
IC封装资料_电容_CGA3E2X7R1H104K080AA.pdf
June2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA10603[0201inch]CGA21005[0402inch]CGA31608[0603inch]CGA420...
2024-12-121329979.74 KB23页111

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