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IC资料

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IC封装资料_电容_CL10C221JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121645259.58 KB3页105
IC封装资料_电容_TAJD477M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12985208.62 KB7页105
IC封装资料_电容_TAJC336K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121534210.32 KB7页105
IC封装资料_电容_TAJB335M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121734210.32 KB7页105
IC封装资料_电容_TAJA475M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12673210.32 KB7页105
IC封装资料_连接器_SM07B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121716661.06 KB4页105
IC封装资料_电容_GRM188R71A474KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12942944.07 KB30页105
IC封装资料_连接器_AFC01-S45H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-128371.58 MB1页105
IC封装资料_电容_ECP-U1C105MA5.pdf
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.S...
2024-12-121297218.77 KB3页105
IC封装资料_电容_DE1B3KX471KN4AP01F.pdf
TypeKXSafetyStandardCertifiedLeadTypeDiscCeramicCapacitorsforGeneralPurposeReferenceSpecificationProductspecificationsinthiscatalo...
2024-12-121235496.59 KB19页105
IC封装资料_电容_CC0402JRNPO9BN220.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12199517.81 MB176页105
IC封装资料_电容_GRM155R71H222JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121815920.26 KB29页105
IC封装资料_电容_0805F226M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127451.05 MB27页105
IC封装资料_电感_YNR4030-151M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121263664.95 KB5页105
IC封装资料_电感_YNR3010-100M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12629661.07 KB5页105
IC封装资料_电容_GRM155R61H474KE11D.pdf
GRM155R61H474KE11_(0402,X5R:EIA,0.47uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12840943.66 KB30页105
IC封装资料_连接器_0.5K-DX-26PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12447453.69 KB1页105
IC封装资料_电容_CL10B103KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12439259.58 KB3页105
IC封装资料_电容_CL10A335MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A335MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121501.42 MB36页105
IC封装资料_电容_0603N330J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-12501.26 MB20页105

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