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IC资料

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IC封装资料_电容_CC0201JRNPO8BN120.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-121961.22 MB13页102
IC封装资料_电容_CL10F224ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216411.42 MB36页102
IC封装资料_电容_CL10B102KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121327452.9 KB21页102
IC封装资料_电源管理芯片_LTC4218IGN_PBF.pdf
LTC421814218fhFormoreinformationwww.linear.com/LTC4218FeaturesapplicationsDescriptionHotSwapControllerTheLTC®4218isaHotSwapcontro...
2024-12-121613397.35 KB18页102
IC封装资料_电容_CL10C470JC81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C470JC81PNC●Product:Multi-layerCeramicCapacitorCAP,47㎊,100V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-122365.8 MB36页102
IC封装资料_电阻_FMF06FTHR010-LH.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121039367.83 KB10页102
IC封装资料_电容_CL03C1R5BB3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127837.46 MB84页102
IC封装资料_电容_CL03C1R2BA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121727.46 MB84页102
IC封装资料_电源管理芯片_LTC2941CDCB_TRPBF.pdf
LTC29411Rev.CFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTIONBatteryGasGaugewithI2CInterfaceTheLTC®2941measuresbatte...
2024-12-121819769.24 KB18页102
IC封装资料_电容_CL10A104KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1263259.58 KB3页102
IC封装资料_电感_SDFL1608Q2R2KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121720457.75 KB7页102
IC封装资料_电容_GJM1555C1H2R7BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1285610.43 MB296页102
IC封装资料_电感_NLV25T-820J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121324316.78 KB6页102
IC封装资料_电源管理芯片_LT1634AIS8-5_PBF.pdf
LT163411634ffFormoreinformationwww.linear.com/LT1634TypicalapplicaTionFeaTuresapplicaTionsDescripTionMicropowerPrecisionShuntVolta...
2024-12-129031.33 MB14页102
IC封装资料_连接器_1755626.pdf
https://www.phoenixcontact.com/us/produkte/175562619.10.2012Page1/7Basestrip-MSTBVA2,5/14-G-1755626Pleasebeinformedthatthedatashow...
2024-12-12344203.35 KB7页102
IC封装资料_电容_GRM1885C1H4R0BA01D.pdf
GRM1885C1H4R0BA01_(0603,C0G:EIA,4pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121363944.09 KB30页101
IC封装资料_电容_0805CG120G101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128371.05 MB27页101
IC封装资料_电容_0805CG101F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129001.05 MB27页101
IC封装资料_电容_CL10F393ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F393ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121097360.43 KB3页101
IC封装资料_电源管理芯片_LTC4210-1CS6_TRPBF.pdf
LTC4210-1/LTC4210-21421012faFormoreinformationwww.linear.com/LTC4210-1TYPICALAPPLICATIONFEATURESDESCRIPTIONHotSwapControllerin6-Le...
2024-12-121591574.87 KB22页101

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