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IC资料

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IC封装资料_电源管理芯片_NCP717.pdf
©SemiconductorComponentsIndustries,LLC,2015February,2015−Rev.71PublicationOrderNumber:NCP717/DNCP717300mA,Very-LowQuiescentCurre...
2024-12-121159629.47 KB16页296
IC封装资料_电容_GRM1885C2A150JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12150944.07 KB30页296
IC封装资料_连接器_AFC11-S44ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-129921.4 MB10页296
IC封装资料_电容_TAJE106K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12663210.32 KB7页296
IC封装资料_数据转换器_AD5668ARUZ-2REEL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-12961.04 MB30页296
IC封装资料_电容_TAJA335K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12143210.32 KB7页295
IC封装资料_电容_CL10C100DB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12261340.04 KB3页295
IC封装资料_电容_T491C107K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-121681.54 MB23页295
IC封装资料_连接器_KF120-2.54-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121943686.3 KB1页295
IC封装资料_电容_GRM1885C1H820JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12375944.07 KB30页295
IC封装资料_连接器_F0502-B-20-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12230290.85 KB1页295
IC封装资料_连接器_KF170V-5.0-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121254207.6 KB1页295
IC封装资料_电容_TAJV337M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121420210.31 KB7页295
IC封装资料_电容_CL10B224KA8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KA8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216341.45 MB36页295
IC封装资料_三极管_2SK3019.pdf
DBNumber:DB-248October2015,RevisionAPage1TAKCHEONG®SEMICONDUCTOR150mWSOT-523SURFACEMOUNTPlasticPackageN-ChannelMOSFETAbsoluteMaxi...
2024-12-12805296.14 KB4页295
IC封装资料_电源管理芯片_REF3212AIDBVR.pdf
1GND_FGND_S32ENABLE564OUT_SINOUT_FREF3212REF3220REF3225REF3230REF3233REF3240REF3212,REF3220REF3225,REF3230REF3233,REF3240www.ti.co...
2024-12-1212331.07 MB22页295
IC封装资料_电容_TAJD686M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12957208.62 KB7页295
IC封装资料_连接器_AFC11-S37ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-126831.4 MB10页295
IC封装资料_电容_GRM188R71H563KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12870944.07 KB30页294
AB-015R0-12V0-M00-B (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT11/1/20061HIGHPOWERLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsare...
2024-12-111631186.79 KB4页294

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