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IC资料

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IC封装资料_电容_CL10B332KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B332KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121214361.46 KB3页89
IC封装资料_电容_0805N101J201CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214751.26 MB20页89
IC封装资料_连接器_A0801AWR-13-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12673334.91 KB1页89
IC封装资料_电容_0805F124M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213791.05 MB27页89
IC封装资料_电容_GRM1885C1H222FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12617944.07 KB30页89
IC封装资料_电容_0805F105M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124191.05 MB27页89
IC封装资料_电容_GRM155R71E562KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121730920.26 KB29页89
IC封装资料_无线芯片及模块_ESP-07.pdf
ESP-07802.11b/g/nWi-Fi��V1.2Copyright©2017ShenzhenAi-ThinkerTechnologyCo.,LtdAllRightsReserved��2�ESP-07802.11b/g/nWi-Fi...
2024-12-121965325.01 KB2页88
IC封装资料_三极管_WSD4066DN.pdf
WSD4066DNwww.winsok.twPage1Dec.2014DualN-ChMOSFETGeneralDescriptionProductSummeryTheWSD4066DNisthehighestperformancetrenchDualN-Ch...
2024-12-1211001.21 MB7页88
IC封装资料_三极管_WSD2068N23.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage20VVGSGate-SourceVoltage±12VID@TA=25℃ContinuousDrainCurrent,VGS@4.5V17.5AID@TA=7...
2024-12-121296958.1 KB6页88
IC封装资料_三极管_NTR5103NT1G.pdf
©SemiconductorComponentsIndustries,LLC,2014June,2019−Rev.11PublicationOrderNumber:NTR5103N/DNTR5103NMOSFET–Single,N-Channel,Sma...
2024-12-121466199.81 KB5页88
IC封装资料_三极管_NTD3055L104T4G.pdf
©SemiconductorComponentsIndustries,LLC,2016May,2019−Rev.101PublicationOrderNumber:NTD3055L104/DNTD3055L104,NTDV3055L104MOSFET–P...
2024-12-1298231.49 KB10页88
IC封装资料_三极管_FQD13N10LTM.pdf
January2014ThermalCharacteristicsSymbolParameterFQD13N10LTM/FQU13N10LTUUnitRJCThermalResistance,JunctiontoCase,Max.3.13oC/WRJA...
2024-12-1213821.29 MB9页88
IC封装资料_三极管_DMG3414U-7.pdf
DMG3414UDocumentnumber:DS31739Rev.5-21of6www.diodes.comMarch2017©DiodesIncorporatedDMG3414UN-CHANNELENHANCEMENTMODEMOSFETFeatures...
2024-12-12758492.52 KB6页88
IC封装资料_电容_TAJV107M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121410210.32 KB7页88
IC封装资料_电容_TAJC476K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121892210.32 KB7页88
IC封装资料_电容_GCJ188R71H102KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-124754.17 MB96页88
IC封装资料_电容_T520D227M010ATE025.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-1216132.01 MB37页88
IC封装资料_电容_1206CG300J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125001.05 MB27页88
IC封装资料_连接器_DF12B-60DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121277288.67 KB11页88

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