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IC资料

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IC封装资料_连接器_1844304.pdf
https://www.phoenixcontact.com/us/produkte/184430410.10.2012Page1/6Basestrip-MC1,5/11-G-3,5-1844304Pleasebeinformedthatthedatashow...
2024-12-12154188.72 KB6页78
IC封装资料_电容_0805F153M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122271.05 MB27页78
IC封装资料_电容_CL10B105MO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121460259.58 KB3页78
IC封装资料_电容_GRM155R71C104MA88D.pdf
GRM155R71C104MA88_(0402,X7R:EIA,0.1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121390970.83 KB30页78
IC封装资料_过压保护_RCLAMP3346P.pdf
RClamp3346PFinalDatasheetRev5.0Revisiondate10/5/2016www.semtech.com1of9SemtechFeatures•ESDprotectionforhigh-speeddatalinestoIEC...
2024-12-12903456.59 KB10页78
IC封装资料_电容_GRM155R61A824KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121736920.26 KB29页78
IC封装资料_电源管理芯片_LTC3859IUHF_TRPBF.pdf
LTC385913859fbTypicalapplicaTionDescripTionLowIQ,TripleOutput,Buck/Buck/BoostSynchronousControllerTheLTC®3859isahighperformancetr...
2024-12-12608631.38 KB42页78
IC封装资料_电容_0603N4R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126531.26 MB20页78
IC封装资料_电容_GRM31CR71H475KA12L.pdf
GRM31CR71H475KA12_(1206,X7R:EIA,4.7uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121992964.38 KB30页78
IC封装资料_电感_SDCL1005C3N9STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121618376.19 KB4页78
IC封装资料_电容_GJM1555C1H5R6CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12164710.43 MB296页78
IC封装资料_电容_0603CG1R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126281.05 MB27页78
IC封装资料_电感_NLV32T-018J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-1298325.74 KB6页78
IC封装资料_电容_0603B152K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210551.05 MB27页78
IC封装资料_电容_CC0805JRX7R9BB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217721.22 MB13页78
IC封装资料_电容_0805CG6R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216691.05 MB27页77
IC封装资料_电容_CL10Y474MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y474MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-121462264.26 KB3页77
IC封装资料_电容_0805B682K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127471.05 MB27页77
IC封装资料_机械式继电器_G6K-2P.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1215391.72 MB9页77
IC封装资料_电容_GRM1555C1H220JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121887920.26 KB29页77

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