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IC封装资料_连接器_KF127-5.08-4P.pdf
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2024-12-12417505.5 KB1页72
IC封装资料_电容_T520B157M006ATE025.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-129032.01 MB37页72
IC封装资料_电容_1206CG221J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123911.05 MB27页72
IC封装资料_连接器_KF2EDGCR-X-5.0-3P.pdf
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2024-12-121267620.86 KB1页72
IC封装资料_连接器_HJ30J-100TJW.pdf
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2024-12-122771.35 MB23页72
IC封装资料_电容_ERR1VM681G20OT.pdf
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2024-12-12174115.39 MB230页72
IC封装资料_电容_1206B122K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125841.05 MB27页72
IC封装资料_电容_JMK063ABJ105MP-F.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-126441.83 MB52页72
IC封装资料_电容_CC0402KRX5R6BB475.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121967998.46 KB11页72
IC封装资料_电感_YP0403-1R0M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121172776.45 KB5页72
IC封装资料_电容_GRM1885C2A680JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12282944.07 KB30页72
IC封装资料_电容_0805N100J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-122551.26 MB20页72
IC封装资料_电感_YNR6045-252M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12852672.55 KB6页72
IC封装资料_电容_CL10B222KB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222KB8NCNC·Product:Multi-layerCeramicCapacitor...
2024-12-1288421.77 KB3页72
IC封装资料_连接器_9631S-22Z02-GFN4.pdf
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2024-12-12302204.61 KB1页72
IC封装资料_电容_CL10B103KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12886361.13 KB3页72
IC封装资料_过压保护_AZC099-04S.pdf
AZC099-04SLowCapacitanceESDProtectionArrayForHighSpeedDataInterfacesRevision2011/07/30©2011-2012AmazingMicro.1www.amazingIC.comFe...
2024-12-12147270.39 KB12页72
IC封装资料_连接器_1804771.pdf
https://www.phoenixcontact.com/us/products/180477110/27/2014Page1/4Basestrip-PCV4/11-G-7,62-1804771Pleasebeinformedthatthedatashow...
2024-12-121555161.73 KB4页72
IC封装资料_电容_CL10C391JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-123391.39 MB36页72
IC封装资料_电容_0603F224Z250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214811.26 MB20页72

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