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IC资料

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IC封装资料_电源管理芯片_LTC3529EDCB_TRPBF.pdf
LTC352913529fb11000100103529TA01bPOWERLOSS(W)0.90.80.70.600.50.40.30.20.1POWERLOSSEFFICIENCYVIN=3.6VINDUCTOR=4.7μH,COOPERBUSSMANN...
2024-12-12140294.4 KB12页270
IC封装资料_电感_NLV32T-820J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12948224.35 KB10页270
IC封装资料_电容_CL10B104KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1218961.45 MB36页270
IC封装资料_电容_0603CG102J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127111.05 MB27页270
IC封装资料_电容_0603B501K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214281.05 MB27页269
IC封装资料_电容_0402CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129441.05 MB27页269
IC封装资料_电感_NLCV25T-3R3M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121549249.79 KB16页269
IC封装资料_连接器_1804849.pdf
https://www.phoenixcontact.com/us/produkte/180484919.10.2012Page1/7Basestrip-PC4/7-G-7,62-1804849Pleasebeinformedthatthedatashowni...
2024-12-121674210.39 KB7页269
IC封装资料_电容_CL10C471JE8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12442316.34 KB3页269
IC封装资料_电源管理芯片_LTM4623IY_PBF.pdf
LTM46231RevDFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTIONUltrathin20VIN,3AStep-DownDC/DCµ...
2024-12-12970382.01 KB28页269
IC封装资料_电容_CC0402CRNPO9BN3R3.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125251.22 MB13页269
IC封装资料_电容_GRM155R71E153KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12747920.26 KB29页269
IC封装资料_电感_SWPA6020S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211941.32 MB22页269
IC封装资料_电容_CL21A106MQFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1210027.46 MB84页269
IC封装资料_连接器_1751316.pdf
https://www.phoenixcontact.com/us/produkte/175131602.11.2012Page1/6PCBterminalblock-MKDS1/9-3,5-1751316Pleasebeinformedthatthedata...
2024-12-12858175.46 KB6页269
IC封装资料_电容_GRM1555C1H390JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121183920.26 KB29页269
IC封装资料_电容_0805CG200G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215161.05 MB27页269
IC封装资料_电感_SDFL1608T270KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121442457.75 KB7页269
IC封装资料_电源管理芯片_LM317LIPK.pdf
C1=0.1µFVI470�R1R2C2=1µFVOAdjustmentOutputInputLM317LProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityLM...
2024-12-1215221.77 MB33页269
IC封装资料_电容_0603B201K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210971.05 MB27页269

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