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IC资料

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IC封装资料_电容_GJM1555C1H5R6CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12164710.43 MB296页78
IC封装资料_电源管理芯片_LT3690EUFE_TRPBF.pdf
LT369013690fbFormoreinformationwww.linear.com/LT3690TypicalapplicaTionFeaTuresDescripTion36V,4A,1.5MHzSynchronousStep-DownSwitchin...
2024-12-1216471.25 MB30页246
IC封装资料_电源管理芯片_LMR10515XMF_NOPB.pdf
GNDFBENVINSWVINC1R3D1L1R2R1C2C3VOUTLMR10515ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICE...
2024-12-1216471.33 MB34页197
IC封装资料_电感_NLV25T-010J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121647316.78 KB6页31
IC封装资料_电源管理芯片_L7812CD2T-TR.pdf
TO-220FPTO-220D²PAKDPAKFeatures•Outputcurrentupto1.5A•Outputvoltagesof5;6;8;8.5;9;12;15;18;24V•Thermaloverloadprotection•Shor...
2024-12-1216471.21 MB55页207
IC封装资料_电容_EMK105B7333KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121647653.27 KB26页206
IC封装资料_连接器_1755493.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBA2,5/7-GOrderNo.:1755493T...
2024-12-121647230.32 KB5页41
IC封装资料_电容_GCM2165C1H471JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1216464.17 MB96页77
AL-XUB361-F8 (A-BRIGHT).pdf
2006/10/18NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111646338.02 KB5页240
IC封装资料_电容_CL10C221JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121646259.58 KB3页105
IC封装资料_电容_TAJV477K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121646210.32 KB7页9
IC封装资料_电容_SPZ0JM271D08C30R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12164615.39 MB230页46
IC封装资料_电感_NLV32T-680J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121645224.35 KB10页118
IC封装资料_电源管理芯片_LT1117CST-5_PBF.pdf
LT1117/LT1117-2.85LT1117-3.3/LT1117-511117fdTYPICALAPPLICATIONFEATURESDESCRIPTION800mALowDropoutPositiveRegulatorsAdjustableandFix...
2024-12-121645271.56 KB16页248
IC封装资料_电容_CL10B153JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121644360.63 KB3页279
IC封装资料_电容_GRM155R61A105ME15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121644920.26 KB29页193
IC封装资料_连接器_KF2EDGCV-X-5.08-12P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121644627.15 KB1页191
IC封装资料_连接器_M55-6012042R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121644318.48 KB3页245
IC封装资料_电感_MLG1005S1N2CT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121644420.58 KB16页87
IC封装资料_电容_CC1206KKX7R8BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216431.22 MB13页198

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