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IC资料

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IC封装资料_电源管理芯片_LTC6655BHMS8-5_TRPBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1215512.42 MB30页193
IC封装资料_电容_GRM1555C1H160GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121551920.26 KB29页192
IC封装资料_电感_MLK1005S12NHT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121551209.31 KB10页261
IC封装资料_连接器_F0502-B-33-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-121551290.85 KB1页77
IC封装资料_电容_CL31A335KAHNNNE.pdf
1.Model:CL31A335KAHNNNE2.DescriptionPartno.Size(inch(mm))Thickness(mm)TemperaturecharateristicsCapacitancevalueCapacitancetoleranc...
2024-12-121551134.18 KB1页142
IC封装资料_电容_CC0603KRX7R8BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215511.22 MB13页159
IC封装资料_电源管理芯片_CN302.pdf
如韵电子CONSONANCEwww.consonance-elec.com1Rev1.0可调整迟滞的低功耗电池检测集成电路CN302概述CN302是一款可调整迟滞的低功耗电池电压检...
2024-12-121551271.43 KB8页192
IC封装资料_电感_7447779006.pdf
Dimensions:[mm]7,3±0,34,5max.7,3±0,31,5u0,24±0,31,5±0,3Scale-2:1StartofWinding•Marking6R8(InductanceCode)ProductMarking:Recom...
2024-12-121551602.57 KB6页34
IC封装资料_电容_GCM1555C1H6R8BA16D.pdf
GCM1555C1H6R8BA16_(0402,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121550943.98 KB29页291
IC封装资料_电感_NLCV25T-3R3M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121550249.79 KB16页269
IC封装资料_三极管_IRLML2803TRPBF.pdf
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2024-12-121550335.16 KB9页59
IC封装资料_电容_TAJB227K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121550210.32 KB7页103
IC封装资料_电容_GRM188R71H152KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121550944.07 KB30页41
IC封装资料_电容_CL10C270GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121549316.17 KB3页267
IC封装资料_三极管_CJ3134K.pdf
JIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDSOT-723Plastic-EncapsulateMOSFETSCJ3134KN-ChannelMOSFETFEATURES�LeadFreeProductisAcq...
2024-12-1215491.43 MB5页61
IC封装资料_电容_TAJD226M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121549208.62 KB7页129
IC封装资料_连接器_DF12C-36DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121549288.67 KB11页118
IC封装资料_电容_CL10C331JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121549316.28 KB3页150
IC封装资料_电容_0603B911K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215491.05 MB27页271
IC封装资料_电感_NLV32T-5R6J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121548224.35 KB10页71

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