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AL-XA1361-F9 (A-BRIGHT).pdf
2006/10/19NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111506335.86 KB5页31
IC封装资料_电容_T55V157M6R3C0040.pdf
T55www.vishay.comVishayPolytechRevision:18-Apr-20191DocumentNumber:40174Fortechnicalquestions,contact:polytech@vishay.comTHISDOCUM...
2024-12-121506782.89 KB27页277
IC封装资料_电容_0805F105Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215061.26 MB20页24
IC封装资料_电容_CL10C560FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121506316.17 KB3页95
IC封装资料_电感_SWPA5040S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215061.32 MB22页139
IC封装资料_电源管理芯片_LT1764ET_PBF.pdf
1LT1764Series1764fb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■DropoutVo...
2024-12-121506360.65 KB20页171
IC封装资料_电源管理芯片_LTC4278IDKD_TRPBF.pdf
LTC427814278fc••••12mΩ1µF30.9Ω24k1.8k38.3k100k12k0.1µF33pF0.1µF2.2nF1µFtONSYNCPGDLYUVLOPWRGDSENSE–VCMPSENSE+RCMPVNEGRCL...
2024-12-121505586.8 KB42页168
IC封装资料_电容_GRM155R60J105ME19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121505920.26 KB29页263
IC封装资料_电感_NLV25T-820J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121505318.58 KB6页98
IC封装资料_电感_NLV25T-101J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-121505215.06 KB9页296
IC封装资料_电容_0603B104K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215051.26 MB20页82
IC封装资料_电容_CL10C181JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121505452.9 KB21页39
IC封装资料_三极管_SI4835DDY-T1-GE3.pdf
VishaySiliconixSi4835DDYNewProductDocumentNumber:69953S09-0136-Rev.B,02-Feb-09www.vishay.com1P-Channel30-V(D-S)MOSFETFEATURES•Hal...
2024-12-121504262.82 KB9页43
IC封装资料_电容_TAJA225K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121504210.32 KB7页296
IC封装资料_电容_CL10C2R7CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121504259.58 KB3页90
IC封装资料_电容_1206B221K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215041.05 MB27页112
IC封装资料_电容_CL21A106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215041.42 MB36页241
IC封装资料_电容_0603X225K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215041.26 MB20页84
IC封装资料_电容_CC0201KRX7R7BB562.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121503998.46 KB11页254
IC封装资料_电源管理芯片_LTC3834IUFD_PBF.pdf
LTC383413834fcFormoreinformationwww.linear.com/LTC3834TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION30µAIQSynchronousStep-Down...
2024-12-121503863.83 KB30页83

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