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IC资料

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IC封装资料_电容_EGC2VM820M40OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12194515.39 MB230页81
IC封装资料_电容_GRM188R71H103KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121945944.07 KB30页224
IC封装资料_连接器_KF2EDGCVM-X-7.62-2P.pdf
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2024-12-121945634.58 KB1页30
IC封装资料_电容_CC0805JRNPO9BN681.pdf
IC封装资料_电容_CC0805JRNPO9BN681.pdf
2024-12-121944735.64 KB1页202
IC封装资料_电容_CC0603KRX7R9BB563.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219441.22 MB13页13
IC封装资料_电容_0603CG910J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219441.05 MB27页3
IC封装资料_电容_GRM033R60J225ME15D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12194410.43 MB296页293
IC封装资料_电容_CL21C010CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1219447.46 MB84页55
IC封装资料_电容_CL21C101JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219441.45 MB36页44
IC封装资料_连接器_1881545.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/12-G-2,5OrderNo.:188154...
2024-12-121944251.38 KB5页87
IC封装资料_电容_GRM1885C2A4R7BA01D.pdf
GRM1885C2A4R7BA01_(0603,C0G:EIA,4.7pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121944943.98 KB30页259
IC封装资料_连接器_9631S-40Z02-GFN4.pdf
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2024-12-121943204.61 KB1页85
IC封装资料_电容_CC0805CRNPO9BN7R0.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121943998.46 KB11页283
IC封装资料_电容_0603F225Z100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219431.26 MB20页223
IC封装资料_电容_CL10F474ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219431.42 MB36页239
IC封装资料_连接器_KF120-2.54-5P.pdf
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2024-12-121943686.3 KB1页295
IC封装资料_电容_TMK063BJ102KP-F.pdf
SpecSheethttp://www.ty-top.comThedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAI...
2024-12-121943224.14 KB1页61
IC封装资料_三极管_IRF530NPBF.pdf
IRF530NPbFHEXFET®PowerMOSFET��ParameterTyp.Max.UnitsRθJCJunction-to-Case–––2.15RθCSCase-to-Sink,Flat,GreasedSu...
2024-12-121943272.41 KB9页288
IC封装资料_三极管_TN2404K-T1-E3.pdf
VishaySiliconixTN2404K/TN2404KL/BS107KLDocumentNumber:72225S12-1767-Rev.C,23-Jul-12www.vishay.com1Thisdocumentissubjecttochangewit...
2024-12-121943315.85 KB9页51
IC封装资料_电源管理芯片_HX7150 _TO-92.pdf
HX71XX系列Ver2.00(1/9)系列LDO线性稳压器■产品简介系列是采用CMOS工艺制造，低功耗的高压稳压器，最高输入电压可达18V，输出电压范围为2V...
2024-12-121942565.81 KB9页86

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