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IC资料

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IC封装资料_电容_CC0805KKX7RABB103.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1213981.22 MB13页289
IC封装资料_电容_597D337X0020H2T.pdf
597Dwww.vishay.comVishaySpragueRevision:16-Jul-20191DocumentNumber:40047Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-121398394.13 KB20页157
IC封装资料_电容_CL10C151JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C151JB81PNC●Product:Multi-layerCeramicCapacitorCAP,150㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1213985.8 MB36页144
IC封装资料_三极管_DMG2305UX-7.pdf
DMG2305UXDocumentnumber:DS36196Rev.7-21of6www.diodes.comSeptember2018©DiodesIncorporatedDMG2305UXP-CHANNELENHANCEMENTMODEMOSFETPr...
2024-12-121398516.35 KB6页202
IC封装资料_电容_TAJC476K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121398210.32 KB7页253
IC封装资料_电容_CL10C6R2CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121398259.58 KB3页20
IC封装资料_连接器_DF12B_3.0_-30DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121398288.67 KB11页192
IC封装资料_连接器_A2541HWV-15P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121397814.87 KB16页115
IC封装资料_电感_MLF2012DR47JT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-121397441.86 KB11页266
IC封装资料_电感_LTF5022T-3R3N2R5-LC.pdf
INDUCTORSApril2016��LTF5022��LTF5022�LTF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/indu...
2024-12-121397319.37 KB9页60
IC封装资料_电源管理芯片_LTC3862IFE-1_PBF.pdf
LTC3862-1138621faFormoreinformationwww.linear.com/LTC3862-1TypicalapplicaTionFeaTuresapplicaTionsDescripTionMulti-PhaseCurrentMode...
2024-12-1213971.63 MB42页67
IC封装资料_电感_SWPA5040S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213971.32 MB22页191
IC封装资料_电感_SDFL2012LR15KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121396457.75 KB7页183
IC封装资料_电容_0603B223J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213961.05 MB27页56
IC封装资料_三极管_ZXMP6A17GTA.pdf
ZXMP6A17GDocumentNumberDS33375Rev.7-21of8www.diodes.comFebruary2015©DiodesIncorporatedADVANCEINFORMATIONZXMP6A17G60VP-CHANNELENHA...
2024-12-121396550.99 KB8页33
IC封装资料_电源管理芯片_TC7660EOA713.pdf
2002-2011MicrochipTechnologyInc.DS21465C-page1TC7660Features•WideInputVoltageRange:+1.5Vto+10V•EfficientVoltageConversion(99.9...
2024-12-1213961.26 MB20页8
IC封装资料_电感_LQG15HN2N0S02D.pdf
SpecNo.:JELF243B_0009U-01P1/12MURATAMFGCO.,LTDCHIPCOILS(CHIPINDUCTORS)LQG15HN□□□□02□REFERENCESPECIFICATION1.ScopeThisreferenc...
2024-12-121396449.39 KB12页135
IC封装资料_电容_0201CG2R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213951.05 MB27页217
IC封装资料_电源管理芯片_LT1963AEST-3.3_PBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-121395629.18 KB28页227
IC封装资料_电容_CL10C151FB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121395452.9 KB21页270

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