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IC资料

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IC封装资料_电容_CC0805KRX7R9BB563.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219981.22 MB13页150
IC封装资料_连接器_1753437.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBV2,5/2-GOrderNo.:1753437T...
2024-12-121998229.81 KB5页26
IC封装资料_电容_GCM188R71H224KA64D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1219974.17 MB96页139
IC封装资料_电容_CL10C330JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121997316.28 KB3页151
IC封装资料_电容_GRM1885C1H1R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121997944.07 KB30页113
IC封装资料_电容_GRM155R71H182JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121997920.26 KB29页130
IC封装资料_电容_CC0402JRNPO9BN220.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12199717.81 MB176页105
IC封装资料_电容_T491B107K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219971.54 MB23页37
IC封装资料_电容_TAJD157M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121997210.32 KB7页205
IC封装资料_三极管_DMP3099L-7.pdf
DMP3099LDocumentnumber:DS36081Rev.3-21of6www.diodes.comMay2013©DiodesIncorporatedDMP3099LNEWPRODUCTP-CHANNELENHANCEMENTMODEMOSFET...
2024-12-121997317.33 KB6页101
IC封装资料_连接器_1755804.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12199636.13 MB445页291
IC封装资料_电容_GRM31CR71H475KA12L.pdf
GRM31CR71H475KA12_(1206,X7R:EIA,4.7uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121996964.38 KB30页78
IC封装资料_电感_SDFL1005LR33KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121996457.75 KB7页75
IC封装资料_电容_CL10A226MPCNUBE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121996259.58 KB3页36
IC封装资料_电容_CL10C332JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121996316.41 KB3页231
IC封装资料_电源管理芯片_TL3843BDR-8.pdf
www.ti.comFEATURES12348765COMPVFBISENSERT/CTVREFVCCOUTPUTGNDD(SOIC)ORP(PDIP)PACKAGE(TOPVIEW)1234567141312111098COMPNCVFBNCISENSENC...
2024-12-121996985.33 KB26页210
IC封装资料_电容_T491A475M025AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219961.54 MB23页300
IC封装资料_电容_GRM188R72A102KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121996944.07 KB30页2
IC封装资料_电容_TAJD107K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121996210.32 KB7页239
IC封装资料_三极管_TDM3452.pdf
August11,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®N-ChannelEnhancementModeMOSFETTDM3452DATASHEETDESCRIPTIONT...
2024-12-121996419.02 KB8页69

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