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IC封装资料_电容_1206CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219971.05 MB27页289
IC封装资料_电容_GCM188R71H224KA64D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1219964.17 MB96页139
IC封装资料_电源管理芯片_LT3652EDD_PBF.pdf
LT365213652feFormoreinformationwww.linear.com/LT3652TYPICALAPPLICATIONDESCRIPTIONPowerTracking2ABatteryChargerforSolarPowerTheLT®...
2024-12-121996600.17 KB26页38
IC封装资料_电容_CL10C330JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121996316.28 KB3页151
IC封装资料_电容_TAJD157M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121996210.32 KB7页205
IC封装资料_三极管_DMP3099L-7.pdf
DMP3099LDocumentnumber:DS36081Rev.3-21of6www.diodes.comMay2013©DiodesIncorporatedDMP3099LNEWPRODUCTP-CHANNELENHANCEMENTMODEMOSFET...
2024-12-121996317.33 KB6页101
IC封装资料_电源管理芯片_HX6206P252MR.pdf
HX6206系列Ver2.0(1/8)管脚序号管脚定义功能说明MR封装形式PP封装形式P1R封装形式SOT23-3SOT89-3SOT89-3112VSS芯片接地端231VOUT芯片输出端...
2024-12-121995655.49 KB8页19
IC封装资料_电容_GCM2165C2A222JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1219954.17 MB96页113
IC封装资料_连接器_1755804.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12199536.13 MB445页291
IC封装资料_电感_SDFL1005LR33KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121995457.75 KB7页75
IC封装资料_电容_CL10A226MPCNUBE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121995259.58 KB3页36
IC封装资料_电容_CL10C332JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121995316.41 KB3页231
IC封装资料_电容_GRM1885C1H1R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121995944.07 KB30页113
IC封装资料_电容_CC0402JRNPO9BN220.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12199517.81 MB176页105
IC封装资料_电容_RVT0J221M0605-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1219951.08 MB3页106
IC封装资料_电源管理芯片_TL3843BDR-8.pdf
www.ti.comFEATURES12348765COMPVFBISENSERT/CTVREFVCCOUTPUTGNDD(SOIC)ORP(PDIP)PACKAGE(TOPVIEW)1234567141312111098COMPNCVFBNCISENSENC...
2024-12-121995985.33 KB26页210
IC封装资料_电容_T491B107K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219951.54 MB23页37
IC封装资料_电容_CC0603KRX5R5BB106.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219941.22 MB13页160
IC封装资料_连接器_1757310.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12199436.13 MB445页238
IC封装资料_电容_1206B103K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219941.05 MB27页59

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