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IC资料

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IC封装资料_电容_0402B472K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213311.05 MB27页81
IC封装资料_电容_GRM155R71E104KE14D.pdf
GRM155R71E104KE14_(0402,X7R:EIA,0.1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121330924.52 KB29页146
IC封装资料_电容_CL21A226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213301.42 MB36页159
IC封装资料_电感_MWSA0603-150MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-121330319.07 KB8页98
IC封装资料_电容_TAJA225M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121330210.32 KB7页214
IC封装资料_电容_GCM21BR71E105KA56L.pdf
GCM21BR71E105KA56_(0805,X7R:EIA,1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121329948.27 KB29页197
IC封装资料_电容_TAJD107K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121329208.62 KB7页115
IC封装资料_电容_GRM188F51H224ZA01D.pdf
GRM188F51H224ZA01_(0603,Y5V,0.22uF,50Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4...
2024-12-121329846.32 KB29页139
IC封装资料_电容_GRM1885C2A361JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121329944.07 KB30页293
IC封装资料_电感_LQW18AN7N5D00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121329361.69 KB12页255
IC封装资料_电容_CL21B334KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B334KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213291.45 MB36页152
IC封装资料_电容_0805CG271J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213281.05 MB27页147
IC封装资料_电容_CL10B103KB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121328259.58 KB3页274
IC封装资料_电容_CL10B102KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121328452.9 KB21页102
IC封装资料_电感_SWPA5020S121MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213281.32 MB22页259
IC封装资料_电容_0603X105K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213281.05 MB27页204
IC封装资料_电容_CL10A106MR5LQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121327259.58 KB3页233
IC封装资料_电感_SDCL1608CR27JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121327376.19 KB4页243
IC封装资料_电感_NLV25T-820J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121327316.78 KB6页102
IC封装资料_电感_NLV25T-101J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121327316.78 KB6页9

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