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IC资料

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IC封装资料_电感_YP0402-150M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121309771.92 KB4页69
IC封装资料_电容_GRM155R71H152JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121309920.26 KB29页77
IC封装资料_电源管理芯片_BQ24250RGER.pdf
SystemLoad33nFCBOOTSYSPGNDSWINVINCIN2.2µFBOOT1.0µHSCLISETLO3MHzPWMVDPM/CEILIMHostSCLSDAGPIO1GPIO2SDAINTLDOSTAT1µF+BATTEMPPACK+P...
2024-12-1213094.78 MB59页194
IC封装资料_连接器_1753699.pdf
https://www.phoenixcontact.com/us/produkte/175369910.10.2012Page1/7Basestrip-MSTBV2,5/15-G-1753699Pleasebeinformedthatthedatashown...
2024-12-121308203.4 KB7页218
IC封装资料_晶体管_ULN2003AINSR.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1213081.39 MB35页55
IC封装资料_电源管理芯片_LT1940EFE_TRPBF.pdf
LT1940/LT1940L11940faTYPICALAPPLICATIOUFEATURESAPPLICATIOSUDESCRIPTIOUIDiskDrivesIDSPPowerSuppliesIWallTransformerRegulationIDistr...
2024-12-121308364.31 KB20页92
IC封装资料_电感_NLV25T-270J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121308318.57 KB6页227
IC封装资料_电容_08051C681KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-121308593.77 KB4页243
IC封装资料_电容_CL10C8R2CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121308316.2 KB3页205
IC封装资料_电容_GCJ188R71H223KA01D.pdf
Lsize1.6±0.2mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1213083.23 MB2页149
IC封装资料_电容_TAJA335M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121308210.32 KB7页285
IC封装资料_电容_TAJA225K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121308210.32 KB7页238
IC封装资料_连接器_KF2EDGCR-X-5.0-7P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121308620.86 KB1页289
IC封装资料_电容_EXV107M035A9MAA.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardA4003_EXV•7/31/2019FortLauderdale,FL33301USA•954-766-2800•ww...
2024-12-1213084.06 MB19页140
IC封装资料_电容_RVT1E471M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1213081.08 MB3页222
IC封装资料_连接器_DF12B_3.0_-60DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121307288.67 KB11页201
IC封装资料_连接器_1757543.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/10-GOrderNo.:1757543Thefigures...
2024-12-121307229.51 KB5页154
IC封装资料_电容_GRM155R71C224KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121306920.26 KB29页132
IC封装资料_电源管理芯片_LT1763IS8-5_PBF.pdf
Formoreinformationwww.linear.com/LT1763LT1763Series11763fhTypicalapplicaTionDescripTion500mA,LowNoise,LDOMicropowerRegulatorsTheLT...
2024-12-1213061.22 MB22页7
IC封装资料_连接器_1727094.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12130636.13 MB445页264

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