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IC资料

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IC封装资料_电容_CL21A226MQQNNNF.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1213117.55 MB84页34
IC封装资料_电容_CL10B104KA8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KA8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1213111.45 MB36页11
IC封装资料_电容_CC0805ZRY5V8BB105.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1213111.08 MB13页96
IC封装资料_电感_YNR2512-220M.pdf
SMDPowerInductors-YNR2512Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121310661.28 KB5页122
IC封装资料_电源管理芯片_NCP308MTADJTBG.pdf
©SemiconductorComponentsIndustries,LLC,2014December,2014−Rev.61PublicationOrderNumber:NCP308/DNCP308,NCV308LowQuiescentCurrent,P...
2024-12-121310222.63 KB11页60
IC封装资料_电容_GRM155R71H152JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121310920.26 KB29页77
IC封装资料_电容_GCJ188R71H223KA01D.pdf
Lsize1.6±0.2mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1213093.23 MB2页149
IC封装资料_电容_TAJA335M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121309210.32 KB7页285
IC封装资料_电容_TAJA225K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121309210.32 KB7页238
IC封装资料_电感_YP0402-150M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121309771.92 KB4页69
IC封装资料_连接器_1757543.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/10-GOrderNo.:1757543Thefigures...
2024-12-121309229.51 KB5页154
IC封装资料_电源管理芯片_LT1940EFE_TRPBF.pdf
LT1940/LT1940L11940faTYPICALAPPLICATIOUFEATURESAPPLICATIOSUDESCRIPTIOUIDiskDrivesIDSPPowerSuppliesIWallTransformerRegulationIDistr...
2024-12-121309364.31 KB20页92
IC封装资料_电感_NLV25T-270J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121309318.57 KB6页227
IC封装资料_电容_GRM155R71C224KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121308920.26 KB29页132
IC封装资料_晶体管_ULN2003AINSR.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1213081.39 MB35页55
IC封装资料_连接器_1753699.pdf
https://www.phoenixcontact.com/us/produkte/175369910.10.2012Page1/7Basestrip-MSTBV2,5/15-G-1753699Pleasebeinformedthatthedatashown...
2024-12-121308203.4 KB7页218
IC封装资料_连接器_1727094.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12130836.13 MB445页264
IC封装资料_电容_08051C681KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-121308593.77 KB4页243
IC封装资料_电容_CL10C8R2CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121308316.2 KB3页205
IC封装资料_电容_TAJB685K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121308210.32 KB7页103

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