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IC资料

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IC封装资料_电容_TAJB684M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121263210.32 KB7页276
IC封装资料_连接器_1881642.pdf
https://www.phoenixcontact.com/pi/products/188164204/10/2019Page1/4Printed-circuitboardconnector-MCV0,5/11-G-2,5-1881642Pleasebein...
2024-12-121263200.84 KB4页240
IC封装资料_电感_YNR4030-151M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121263664.95 KB5页105
IC封装资料_电源管理芯片_LT6654AHS6-3.3_TRPBF.pdf
LT665416654fhFormoreinformationwww.linear.com/LT6654TypicalapplicaTionDescripTionPrecisionWideSupplyHighOutputDriveLowNoiseReferen...
2024-12-1212631.05 MB22页119
IC封装资料_电容_CC1206KKX7R9BB154.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121263998.46 KB11页30
IC封装资料_连接器_1733619.pdf
https://www.phoenixcontact.com/us/produkte/173361921.12.2012Page1/6PCBterminalblock-SMKDSP1,5/6-5,08-1733619Pleasebeinformedthatth...
2024-12-121263178.83 KB6页2
IC封装资料_电感_MLP2012SR47MT0S1.pdf
April2018INDUCTORSMultilayerferriteMLP20122012[0805inch]**DimensionsCodeJIS[EIA]InductorsforpowercircuitsMLP2012typeMLPseries更多...
2024-12-121263334.72 KB17页252
IC封装资料_电感_NLCV25T-R15M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121262249.79 KB16页221
IC封装资料_电感_LQG15HS18NJ02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121262361.38 KB11页105
IC封装资料_电容_1206B223K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212621.05 MB27页166
IC封装资料_三极管_TDM3412.pdf
July15,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®DualN-ChannelEnhancementModeMOSFETTDM3412DATASHEETDESCRIPTIO...
2024-12-121261953.84 KB13页155
IC封装资料_连接器_DF12C_3.0_-80DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121261288.67 KB11页68
IC封装资料_电容_CL10B223KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121261361.48 KB3页104
IC封装资料_连接器_1935255.pdf
https://www.phoenixcontact.com/us/products/193525508/04/2015Page1/6PCBterminalblock-PT1,5/11-5,0-H-1935255Pleasebeinformedthatthed...
2024-12-121261172.22 KB6页168
IC封装资料_电感_NLV32T-271J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121261325.01 KB6页44
IC封装资料_电容_CC0603KRX7R8BB273.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212611.22 MB13页193
IC资料_HLS27DBW0430C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151260673.17 KB8页174
IC资料_HLS27DWB0430C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151260673.17 KB8页257
IC封装资料_电容_TAJV337K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121260210.32 KB7页160
IC封装资料_电容_GCM1885C1H332JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212604.17 MB96页232

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