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IC封装资料_电源管理芯片_LT6654AHS6-3.3_TRPBF.pdf
LT665416654fhFormoreinformationwww.linear.com/LT6654TypicalapplicaTionDescripTionPrecisionWideSupplyHighOutputDriveLowNoiseReferen...
2024-12-1212621.05 MB22页119
IC封装资料_电容_CC1206KKX7R9BB154.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121262998.46 KB11页30
IC封装资料_电感_MLP2012SR47MT0S1.pdf
April2018INDUCTORSMultilayerferriteMLP20122012[0805inch]**DimensionsCodeJIS[EIA]InductorsforpowercircuitsMLP2012typeMLPseries更多...
2024-12-121262334.72 KB17页252
IC封装资料_三极管_PSMN6R0-30YL_115.pdf
1.Productprofile1.1GeneraldescriptionLogiclevelN-channelenhancementmodeField-EffectTransistor(FET)inaplasticpackageusingTrenchMOSt...
2024-12-1212621.04 MB14页34
IC封装资料_电容_TC211A106K010Y.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-121262350.17 KB10页82
IC封装资料_电容_TAJB684M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121262210.32 KB7页276
IC封装资料_连接器_DF12D_5.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121262288.67 KB11页132
IC封装资料_电容_1206B223K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212611.05 MB27页166
IC封装资料_连接器_1935255.pdf
https://www.phoenixcontact.com/us/products/193525508/04/2015Page1/6PCBterminalblock-PT1,5/11-5,0-H-1935255Pleasebeinformedthatthed...
2024-12-121261172.22 KB6页168
IC封装资料_电感_NLV32T-271J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121261325.01 KB6页44
IC封装资料_电感_NLCV25T-R15M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121261249.79 KB16页221
IC封装资料_电感_LQG15HS18NJ02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121261361.38 KB11页105
IC封装资料_电源管理芯片_AZ1117H-3.3TRG1.pdf
1Mar.2008Rev.2.1BCDSemiconductorManufacturingLimited1ALOWDROPOUTLINEARREGULATORAZ1117DataSheetGeneralDescriptionTheAZ1117isaseries...
2024-12-121260806.36 KB24页82
IC封装资料_三极管_TDM3412.pdf
July15,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®DualN-ChannelEnhancementModeMOSFETTDM3412DATASHEETDESCRIPTIO...
2024-12-121260953.84 KB13页155
IC封装资料_三极管_DMN5L06DWK-7.pdf
DMN5L06DWKDocumentnumber:DS30930Rev.8-31of6www.diodes.comJanuary2019©DiodesIncorporatedDMN5L06DWKDUALN-CHANNELENHANCEMENTMODEMOSF...
2024-12-121259709.52 KB6页72
IC封装资料_电容_CL10B223KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121259361.48 KB3页104
IC封装资料_电容_CC0603KRX7R8BB273.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212591.22 MB13页193
IC封装资料_电容_GCM1885C1H332JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212594.17 MB96页232
IC封装资料_电容_GCM1885C1H330FA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1212595.94 MB73页96
IC封装资料_电感_NLV25T-068J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121259318.58 KB6页75

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