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IC资料

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IC封装资料_三极管_DTC144EUAT106.pdf
DTC144EseriesNPN100mA50VDigitalTransistors(BiasResistorBuilt-inTransistors)DatasheetllOutlineParameterValueVMT3EMT3FVCC50VIC(MAX.)...
2024-12-1212081.56 MB11页283
IC封装资料_连接器_1803439.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12120836.13 MB445页121
IC封装资料_电容_GRM188R61E475KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121208944.07 KB30页135
IC封装资料_电容_0805B561K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1212081.26 MB20页53
IC封装资料_电容_0603CG1R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212081.05 MB27页214
IC封装资料_电容_GRM1555C1H330GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121207920.26 KB29页192
IC封装资料_电源管理芯片_LTC3035EDDB_TRMPBF.pdf
LTC303513035f■WideInputVoltageRange:1.7Vto5.5V■WideAdjustableOutputVoltageRange:0.4Vto3.6V■Built-InChargePumpGeneratesHighSideB...
2024-12-121207290.37 KB12页184
IC封装资料_电容_CC0805JRNPO0BN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212071.22 MB13页129
IC封装资料_电容_GCM21BR7YA105KA55L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212074.17 MB96页2
IC封装资料_电容_1210B474K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212071.05 MB27页77
IC封装资料_电容_GCJ32QR72J103KXJ1L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212074.17 MB96页207
IC封装资料_三极管_SI9933CDY-T1-GE3.pdf
VishaySiliconixSi9933CDYNewProductDocumentNumber:68791S-81729-Rev.A,04-Aug-08www.vishay.com1DualP-Channel20-V(D-S)MOSFETFEATURES•...
2024-12-121206294.3 KB9页218
IC封装资料_电容_CL10C101JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121206340.15 KB3页270
IC封装资料_电容_TAJA226K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121206210.32 KB7页233
IC封装资料_电容_GRM188R70J104KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121206944.07 KB30页68
IC封装资料_电容_GRM1885C1H751JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121206944.07 KB30页188
IC封装资料_电容_UCD1V330MCL1GS.pdf
132UUUUA247jCD(φ4toφ8×6.2)(φ12.5toφ18)(φ8×10,φ10)0.3MAX.φD±0.5B±0.2A±0.2A±0.2C±0.20.5MAX.EHH0.3MAX.φD±0.5B±0.2A±...
2024-12-121206817.62 KB2页126
IC封装资料_电容_CC0402CRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121206998.46 KB11页290
IC封装资料_电容_CL10A475KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121206259.58 KB3页113
IC封装资料_电源管理芯片_LTC3025EDC-1_TRPBF.pdf
LTC3025-1/LTC3025-2/LTC3025-3/LTC3025-4130251234ffTypicalapplicaTionFeaTuresapplicaTionsDescripTion500mAMicropowerVLDOLinearRegula...
2024-12-121206333.78 KB14页43

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