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IC资料

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IC封装资料_电源管理芯片_LT3825EFE_TRPBF.pdf
LT382513825feTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONIsolatedNo-OptoSynchronousFlybackControllerwithWideInputSupplyRangen...
2024-12-121921464.22 KB32页264
IC封装资料_电容_CC0201JRNPO8BN270.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219211.22 MB13页233
IC封装资料_连接器_1803303.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12192136.13 MB445页108
IC封装资料_电容_CL10F105ZP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121920259.58 KB3页140
IC封装资料_电容_CL21C510JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121920315.92 KB3页225
IC封装资料_电容_TAJC337K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121920210.32 KB7页9
IC封装资料_电源管理芯片_UC3845BD1R2G.pdf
©SemiconductorComponentsIndustries,LLC,2013August,2013−Rev.111PublicationOrderNumber:UC3844B/DUC3844B,UC3845B,UC2844B,UC2845BHig...
2024-12-121920482.14 KB19页244
IC封装资料_电源管理芯片_ADP1708ARDZ-R7.pdf
1A,LowDropout,CMOSLinearRegulatorDataSheetADP1706/ADP1707/ADP1708Rev.ADocumentFeedbackInformationfurnishedbyAnalogDevicesisbelieve...
2024-12-121919608.98 KB20页177
IC封装资料_电源管理芯片_LM285DR-1-2.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityLM285-1.2,LM385-1.2,LM385B-1.2SLVS075J–APRIL1989–REVISED...
2024-12-1219191.76 MB28页269
IC封装资料_电感_SWPA3012S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219191.32 MB22页50
IC封装资料_电容_CL03C8R2CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1219191.4 MB36页60
IC封装资料_电容_CL10A475MO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121919259.57 KB3页166
IC封装资料_电感_WPN252012H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121919624.92 KB9页266
IC封装资料_电容_CL10C2R4CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121919259.58 KB3页204
IC封装资料_三极管_2N7002KW.pdf
©SemiconductorComponentsIndustries,LLC,2011May,2018−Rev.11PublicationOrderNumber:2N7002KW/D2N7002KWN-ChannelEnhancementModeField...
2024-12-121919205.03 KB5页134
IC封装资料_微控制器_MM32F103C8T6.pdf
数据手册DatasheetMM32F103xx32��ARMCortexM3��1.02_n保留不通知的情况下，更改相关资料的权利更多资料下载请到五八...
2024-12-1219192.33 MB65页120
IC封装资料_电容_CC0603CRNPO9BN3R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219181.22 MB13页38
IC封装资料_电容_CL03A224MQ3NNND.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1219187.55 MB84页173
IC封装资料_电容_CL21A226MPQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1219181.42 MB36页188
IC封装资料_电容_CL21B272KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1219187.46 MB84页28

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