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IC资料

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IC封装资料_电感_NLV32T-082J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121140224.35 KB10页105
IC封装资料_电容_CC0805KRX7R9BB152.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211401.22 MB13页149
IC封装资料_电源管理芯片_LT8620EMSE_TRPBF.pdf
LT862018620faFormoreinformationwww.linear.com/LT8620LOADCURRENT(A)0EFFICIENCY(%)80901001.758620TA01b70607585956555500.50.750.251.0...
2024-12-121139634.59 KB26页108
IC封装资料_电源管理芯片_LT1964EDD_PBF.pdf
LT196411964fbTYPICALAPPLICATIONDESCRIPTION200mA,LowNoise,LowDropoutNegativeMicropowerRegulatorTheLT®1964isamicropowerlownoise,low...
2024-12-121139310.3 KB16页97
IC封装资料_电容_CC0805KKX7R9BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211391.22 MB13页225
IC封装资料_线性稳压器_LT1763CS8_PBF.pdf
Formoreinformationwww.linear.com/LT1763LT1763Series11763fhTypicalapplicaTionDescripTion500mA,LowNoise,LDOMicropowerRegulatorsTheLT...
2024-12-1211391.25 MB23页26
IC封装资料_电容_TAJV157K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121139210.32 KB7页225
IC封装资料_电容_CL10B682KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B682KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,6.8㎋,50V,±...
2024-12-121138228.47 KB2页219
IC封装资料_电容_1206B224K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211381.05 MB27页106
IC封装资料_电容_GCM2165C2A681JA16D.pdf
GCM2165C2A681JA16_(0805,C0G,680pF,100Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4...
2024-12-121138841.38 KB28页300
IC封装资料_电容_CL10A474KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121138259.58 KB3页171
IC封装资料_电容_CC1206KKX7R0BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211381.22 MB13页7
IC封装资料_电容_CL21A106KQCLNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1211371.45 MB36页59
IC封装资料_光电器件_EL357N_B__TA_-G.pdf
4PINULTRASMALLSOPPHOTOTRANSISTORPHOTOCOUPLEREverlightElectronicsCo.,Ltd.1http://www.everlight.comDocumentNo：DPC-0000014Rev.4Decem...
2024-12-121137971.42 KB11页251
IC封装资料_连接器_53398-0971.pdf
TABLE11番号NO.部品PART材質MATERIAL①ハウジングHOUSINGポリアミド(PA),UL94V-0,GLASS-FILLED,色:ナチュラル(ベージュ)POLYAMIDE(PA),UL94...
2024-12-121137855.65 KB4页65
IC封装资料_电感_LQW15AN62NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121136376.63 KB15页100
IC封装资料_三极管_BSS138DW-7-F.pdf
BSS138DWDocumentnumber:DS30203Rev.13-21of6www.diodes.comJanuary2014©DiodesIncorporatedBSS138DWDUALN-CHANNELENHANCEMENTMODEFIELDEF...
2024-12-121136296.85 KB6页106
IC封装资料_连接器_KF136-10.16-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121136612.96 KB1页43
IC封装资料_电源管理芯片_TLC5920DLR.pdf
TLC592016x8BITLEDDRIVER/CONTROLLERSLAS264A–MARCH2000REVISEDSEPTEMBER20021POSTOFFICEBOX655303•DALLAS,TEXAS75265�DriveCapability:...
2024-12-121136465.24 KB15页187
IC封装资料_连接器_AFC01-S08FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1211361.85 MB10页37

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