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IC资料

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IC封装资料_电感_NLV32T-082J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121140224.35 KB10页105
IC封装资料_电容_CC0805KRX7R9BB152.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211401.22 MB13页149
IC封装资料_电源管理芯片_AP2204K-5.0TRG1.pdf
AP2204Documentnumber:DS37168Rev.5-21of18www.diodes.comJuly2018©DiodesIncorporatedAP2204WIDEINPUTVOLTAGERANGE,150mAULDOREGULATORDe...
2024-12-121140890.63 KB18页287
IC封装资料_电感_LQM21PN1R0MC0D.pdf
ChipInductors(ChipCoils)O05E.pdfApr.28,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-12114012.72 MB434页271
IC封装资料_电容_GCM2165C2A681JA16D.pdf
GCM2165C2A681JA16_(0805,C0G,680pF,100Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4...
2024-12-121139841.38 KB28页300
IC封装资料_电容_TAJV157K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121139210.32 KB7页225
IC封装资料_连接器_KF136-10.16-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121139612.96 KB1页43
IC封装资料_电容_CL10B682KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B682KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,6.8㎋,50V,±...
2024-12-121139228.47 KB2页219
IC封装资料_电源管理芯片_LT1964EDD_PBF.pdf
LT196411964fbTYPICALAPPLICATIONDESCRIPTION200mA,LowNoise,LowDropoutNegativeMicropowerRegulatorTheLT®1964isamicropowerlownoise,low...
2024-12-121139310.3 KB16页97
IC封装资料_电容_CC0805KKX7R9BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211391.22 MB13页225
IC封装资料_电容_CL10A474KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121138259.58 KB3页171
IC封装资料_电源管理芯片_LT4256-1CS8_TRPBF.pdf
LT4256-1/LT4256-21425612faAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOUTheLT®4256-1/LT4256-2arehighvoltageHotSwapTMcontroller...
2024-12-121138283.94 KB16页41
IC封装资料_电容_CC1206KKX7R0BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211381.22 MB13页7
IC封装资料_连接器_53398-0971.pdf
TABLE11番号NO.部品PART材質MATERIAL①ハウジングHOUSINGポリアミド(PA),UL94V-0,GLASS-FILLED,色:ナチュラル(ベージュ)POLYAMIDE(PA),UL94...
2024-12-121138855.65 KB4页65
IC封装资料_电容_1206B224K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211381.05 MB27页106
IC封装资料_三极管_BSS138DW-7-F.pdf
BSS138DWDocumentnumber:DS30203Rev.13-21of6www.diodes.comJanuary2014©DiodesIncorporatedBSS138DWDUALN-CHANNELENHANCEMENTMODEFIELDEF...
2024-12-121137296.85 KB6页106
IC封装资料_电容_CL21A106KQCLNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1211371.45 MB36页59
IC封装资料_光电器件_EL357N_B__TA_-G.pdf
4PINULTRASMALLSOPPHOTOTRANSISTORPHOTOCOUPLEREverlightElectronicsCo.,Ltd.1http://www.everlight.comDocumentNo：DPC-0000014Rev.4Decem...
2024-12-121137971.42 KB11页251
IC封装资料_电容_0402N3R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211371.26 MB20页151
IC封装资料_电容_GMK107BJ105KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121136857.12 KB55页207

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