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IC资料

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IC封装资料_电源管理芯片_AP3032KTR-G1.pdf
DataSheetWHITELEDSTEP-UPCONVERTERAP3032Dec.2012Rev.1.2BCDSemiconductorManufacturingLimited1GeneralDescriptionTheAP3032isaninductor...
2024-12-121126565.41 KB13页48
IC封装资料_电感_IHLP2525CZER220M11.pdf
IHLP-2525CZ-11www.vishay.comVishayDaleRevision:12-Oct-171DocumentNumber:34190Fortechnicalquestions,contact:magnetics@vishay.comTHI...
2024-12-121126232.99 KB3页65
IC封装资料_连接器_1729076.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMKDSN1,5/8OrderNo.:1729076The...
2024-12-121125243.66 KB6页156
IC封装资料_连接器_DF12B_4.0_-20DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121125288.67 KB11页220
IC封装资料_电容_CL21X226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21X226MQQNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1211251.48 MB36页43
IC封装资料_电容_GRM1885C1H9R1DA01D.pdf
GRM1885C1H9R1DA01_(0603,C0G:EIA,9.1pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121125944.12 KB30页5
IC封装资料_电容_0603B512K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211251.05 MB27页24
IC封装资料_电容_CL10B471KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B471KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121124361.35 KB3页18
IC封装资料_连接器_A2541HWV-8P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121124814.66 KB16页298
IC封装资料_电容_0402B122K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211231.26 MB20页151
IC封装资料_电容_0402B102M500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211231.26 MB20页271
IC封装资料_电感_SWPA3012S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211231.32 MB22页284
IC封装资料_电源管理芯片_MC7815BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-121122296.53 KB31页233
IC封装资料_电容_CC0402CRNPO9BN2R2.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12112217.81 MB176页258
IC封装资料_电感_YNR4018-101M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121122661.38 KB5页149
IC封装资料_电源管理芯片_LTC3854IDDB_TRPBF.pdf
LTC385413854fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONSmallFootprint,WideVINRangeSynchronousStep-DownDC/DCControllerTheLT...
2024-12-121122617.46 KB28页135
IC封装资料_电感_SDCL1608C4N7STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121122376.19 KB4页99
IC封装资料_电容_GRM1555C1H3R9BA01D.pdf
GRM1555C1H3R9BA01_(0402,C0G:EIA,3.9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121122944.3 KB30页257
IC封装资料_电容_1210X106M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211221.05 MB27页114
IC封装资料_电感_YSPI0420-6R8M.pdf
SMDPowerInductors-YSPI0420Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121122700.01 KB4页80

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