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IC封装资料_三极管_DMC4029SK4-13.pdf
DMC4029SK4Documentnumber:DS37823Rev.3-21of10www.diodes.comJune2016©DiodesIncorporatedADVANCEINFORMATIONDMC4029SK4COMPLEMENTARYPAI...
2024-12-121070833.48 KB10页44
IC封装资料_电容_TAJD687M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121070210.32 KB7页186
IC封装资料_电容_CL10C2R2CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121070259.58 KB3页100
IC封装资料_电容_CC0402KRNPO9BN221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210701.22 MB13页270
61-24UWC (A-BRIGHT).pdf
NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.3.Polarityreferringontothecath...
2024-12-111069340.98 KB6页189
IC封装资料_无线芯片及模块_AP6256.pdf
AMPAKTechnologyInc.www.ampak.com.twProprietary&ConfidentialInformationDoc.NO:正基科技股份有限公司SPECIFICATIONSPEC.NO.：REV：1.3DA...
2024-12-1210692.16 MB34页95
IC封装资料_电容_CL10C030CB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C030CB81PNC●Product:Multi-layerCeramicCapacitorCAP,3㎊,50V,±0.25㎊,C0G,0603●AEC-Q200Qual...
2024-12-1210695.8 MB36页56
IC封装资料_电容_UWT1V101MCL1GS.pdf
114ALUMINUMELECTROLYTICCAPACITORSU1W2T314C5160708M9C10L11112G13B14ConfigurationPackagecodeSizecodeCapacitancetolerance(±20%)Rated...
2024-12-121069769.15 KB2页210
IC封装资料_电感_MLF1608A4R7KTA00.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121068311.11 KB11页253
IC封装资料_电容_0201CG4R7C250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210681.05 MB27页170
IC封装资料_电容_T491B475K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1210681.54 MB23页263
IC封装资料_电容_GRM1885C1HR50BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121068944.07 KB30页216
IC封装资料_连接器_1830596.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12106836.13 MB445页63
IC封装资料_电感_SWPA4030S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210681.32 MB22页189
IC封装资料_电容_GRM155R61A474KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121067920.26 KB29页54
IC封装资料_电容_0603N470J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210671.26 MB20页96
IC封装资料_电源管理芯片_IR2110STRPBF.pdf
Features•FloatingchanneldesignedforbootstrapoperationFullyoperationalto+500Vor+600VToleranttonegativetransientvoltagedV/dtimmune...
2024-12-121067535.41 KB17页171
IC资料_T18-2VNLPC-Q8 (BANNER).pdf
DatasheetNextGenerationofSelf-Containeddc-OperatedSensors•Completefamilyofsensors,allhousedinthecompactrightangle18mmthreadedhous...
2024-12-151067771.82 KB10页270
IC封装资料_电容_TAJV157M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121067210.32 KB7页268
IC封装资料_电源管理芯片_SG3525ADWR2G.pdf
�SemiconductorComponentsIndustries,LLC,2005January,2005−Rev.51PublicationOrderNumber:SG3525A/DSG3525APulseWidthModulatorControlC...
2024-12-121067231.96 KB10页283

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