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IC封装资料_连接器_1759088.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12106136.13 MB445页242
IC封装资料_三极管_BS170.pdf
TolearnmoreaboutONSemiconductor,pleasevisitourwebsiteatwww.onsemi.comPleasenote:AspartoftheFairchildSemiconductorintegration,someo...
2024-12-1210601.47 MB17页225
IC封装资料_电容_1206B471K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210601.05 MB27页227
IC封装资料_电容_EGD2EM2R2E12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12106015.39 MB230页130
IC封装资料_连接器_5103308-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121060190.54 KB1页218
IC封装资料_电感_LQP15MN2N4B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-121060245 KB9页24
IC封装资料_电源管理芯片_A0515S-2W.pdf
YUANDC-DCCONVERTERShenzhenSunyuanTechnologyCo.,Ltd.A系列AxxxxS-xW1KVDC隔离1W～2W非稳压单输出SIP7脚封装输入电压5,12,15,24VDC输出电...
2024-12-121060365.29 KB3页227
IC封装资料_电感_LQG15HN4N3S02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121060273.56 KB11页216
IC封装资料_电容_CC0402KRX7R9BB181.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210601.22 MB13页175
IC封装资料_连接器_1803345.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12105936.13 MB445页178
IC封装资料_电容_1206B102K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210591.05 MB27页231
IC封装资料_电容_0805N391J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210591.26 MB20页102
IC封装资料_电容_0805N120J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210591.26 MB20页26
IC封装资料_过压保护_DESD1P0RFW-7.pdf
DESD1P0RFWDocumentnumber:DS35278Rev.5-21of4www.diodes.comSeptember2011©DiodesIncorporatedDESD1P0RFWADVANCEINFORMATIONLOWCAPACITAN...
2024-12-121059173.74 KB5页293
IC封装资料_电容_GJM1555C1HR90WB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12105910.43 MB296页218
IC封装资料_电感_MLK1005S68NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121059209.31 KB10页283
IC封装资料_电容_CC0805JRX7RYBB222.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121059998.46 KB11页181
IC封装资料_连接器_1730120.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12105936.13 MB445页167
IC封装资料_连接器_1755846.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12105836.13 MB445页159
IC封装资料_电容_0603B562K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210581.26 MB20页133

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