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IC封装资料_电源管理芯片_TPS82085SILR.pdf
Load(A)Efficiency(%)607080901001m10m100m15D002VIN=3.0VVIN=3.5VVIN=4.0VVIN=5.0VTPS820852.5Vto6VR1200kR2160kVINPOWERGOODVOUTFBVINGND...
2024-12-129951.48 MB25页39
IC封装资料_电容_C1608Y5V1H104Z.pdf
Issuedate:April2011TDKMLCCUSCatalogVersionB11CSeriesGeneralApplicationType:C0402[EIACC01005]C0603[EIACC0201]C1005[EIACC0402]C1608[...
2024-12-129951.42 MB72页291
IC封装资料_电源管理芯片_LTC4352IMS_TRPBF.pdf
LTC435214352faTypicalapplicaTionDescripTionLowVoltageIdealDiodeControllerwithMonitoringTheLTC®4352createsanear-idealdiodeusingane...
2024-12-12995307.26 KB16页40
IC封装资料_电感_NLV32T-2R2J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12995325.74 KB6页280
IC封装资料_电感_LQW15AN24NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12994376.63 KB15页241
IC封装资料_电感_LQH32CN100K33L.pdf
SpecNo.JELF243A-0040T-01P1/8MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL（CHIPINDUCTORS）LQH32CN□□□□33LREFERENCESPECIFICATION1.Scope...
2024-12-12993303.56 KB8页25
IC封装资料_电容_TAJD335M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12993210.32 KB7页104
IC封装资料_连接器_FH12-7S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12993339.76 KB6页225
IC封装资料_电容_RVT1E220M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-129931.08 MB3页278
IC封装资料_连接器_AFC11-S44ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-129921.4 MB10页296
IC封装资料_电容_CL10B105KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-129921.45 MB36页242
IC封装资料_电容_CL03C2R2BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-129921.4 MB36页77
IC封装资料_电容_0402B153K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129921.26 MB20页3
IC封装资料_电容_0201CG470K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129911.05 MB27页87
IC封装资料_连接器_FH12-11S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12991339.76 KB6页231
IC封装资料_电容_CC0402KRX5R6BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-129911.22 MB13页285
IC封装资料_电容_GRM1885C2A180JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12991944.07 KB30页22
IC封装资料_电容_GRM1555C1H120GA01D.pdf
GRM1555C1H120GA01_(0402,C0G:EIA,12pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12991944.26 KB30页215
IC封装资料_电容_0603N560J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129901.26 MB20页35
IC封装资料_电源管理芯片_LTC3630EMSE_TRPBF.pdf
LTC363013630fdFormoreinformationwww.linear.com/LTC3630TypicalapplicaTionFeaTuresDescripTionHighEfficiency,65V500mASynchronousStep-...
2024-12-12990373.83 KB26页27

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