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IC资料

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IC封装资料_电容_CL10B472KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12977259.58 KB3页263
IC封装资料_电容_1206B226K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129771.05 MB27页18
IC封装资料_电容_0402X104K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129771.26 MB20页154
IC封装资料_电容_C3225X5R1E106KTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-129771.61 MB56页239
IC封装资料_电容_CL10C680JB8NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-129777.55 MB84页201
IC封装资料_电感_MLZ1608M100WT000.pdf
May2017INDUCTORSMultilayerFerriteMLZ16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforDecouplingCircuitsMLZ1608TypeMLZSeries更...
2024-12-12977335.39 KB10页42
IC封装资料_电容_0402CG1R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129771.05 MB27页271
IC封装资料_电容_0603N4R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129761.26 MB20页23
IC封装资料_连接器_KF141V-2.54-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12976672.18 KB1页130
IC封装资料_电感_LQG15HS22NJ02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12976361.38 KB11页123
IC封装资料_连接器_1376383-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12976180.45 KB1页74
IC封装资料_电感_MLF1608DR68JT.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-12975311.11 KB11页36
IC封装资料_电容_CC0402KRX7R9BB332.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1297517.81 MB176页90
IC封装资料_电容_0805CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129751.05 MB27页85
IC封装资料_电容_CL10C510JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12975259.57 KB3页172
IC封装资料_电容_GRM188R71H154KAC4D.pdf
GRM188R71H154KAC4_(0603,X7R:EIA,0.15uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12975965.47 KB30页243
IC封装资料_电容_ERK2GM100F11OT.pdf
|A川川I~'jI~.~盯ROLYTICCAPACITORSAiSH~PartNumberingSystem日E回8:liJ囚lli囚~回113114国回①Category∞deCodeTypeEle恼。IyticCspacitor...
2024-12-129754.6 MB8页31
IC封装资料_电容_CL10C150KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12974340.37 KB3页153
IC封装资料_连接器_1935226.pdf
https://www.phoenixcontact.com/us/products/193522608/04/2015Page1/6PCBterminalblock-PT1,5/8-5,0-H-1935226Pleasebeinformedthattheda...
2024-12-12974172.18 KB6页141
IC封装资料_电容_0402B222J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129741.26 MB20页15

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