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IC封装资料_电容_TAJB475M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12953210.32 KB7页46
IC封装资料_连接器_DF12E_3.5_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12953288.67 KB11页3
IC封装资料_电容_CC1210KKX7RCBB223.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12953814.82 KB14页275
IC封装资料_电源管理芯片_MAX6225AESA+.pdf
GeneralDescriptionTheMAX6225/MAX6241/MAX6250arelow-noise,pre-cisionvoltagereferenceswithextremelylow1ppm/°Ctemperaturecoefficient...
2024-12-129522.39 MB11页173
IC封装资料_电容_C3216X5R1V226M160AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129521.67 MB57页208
IC封装资料_电源管理芯片_LT3757EMSE_TRPBF.pdf
LT3757/LT3757A13757afeFormoreinformationwww.linear.com/LT3757nWideInputVoltageRange:2.9Vto40VnPositiveorNegativeOutputVoltageProgr...
2024-12-12952687.18 KB36页219
IC封装资料_电容_CL10C221JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-129521.42 MB36页292
IC封装资料_电容_CL10C3R9BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12952259.58 KB3页71
IC封装资料_电容_GRM188R61A106ME69D.pdf
GRM188R61A106ME69_(0603,X5R:EIA,10uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12952939.11 KB30页122
IC封装资料_电感_MLF2012C101KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-12952441.85 KB11页40
IC封装资料_电感_SDFL2012T470KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12951457.75 KB7页33
IC封装资料_电容_GJM1555C1H270FB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1295110.43 MB296页59
IC封装资料_电容_0603CG200G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129511.05 MB27页260
IC封装资料_电感_NLC453232T-4R7K-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12951249.79 KB16页257
IC封装资料_电容_0603B222J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129511.26 MB20页228
IC封装资料_三极管_BSS138PW_115.pdf
1.Productprofile1.1GeneraldescriptionN-channelenhancementmodeField-EffectTransistor(FET)inaverysmallSOT323(SC-70)Surface-MountedDe...
2024-12-12951989.86 KB16页40
IC封装资料_电容_TAJB686M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12951210.32 KB7页199
IC封装资料_电容_CL10B334KA8VPNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B334KA8VPNCProduct:Multi-layerCeramicCapacitorDescription:CAP,330㎋,25V,±...
2024-12-12951237.83 KB2页1
IC封装资料_电容_GRM1555C1H2R0BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12950920.26 KB29页231
IC封装资料_电容_1206B182K201NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129501.05 MB27页156

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