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IC资料

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IC封装资料_电容_0805B106K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129531.05 MB27页129
IC封装资料_电容_CC1206KRX7RABB681.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12953998.46 KB11页75
IC封装资料_电容_CC1210KKX7RCBB223.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12952814.82 KB14页275
IC封装资料_电容_CL10C3R9BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12952259.58 KB3页71
IC封装资料_电容_CL10C221JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-129511.42 MB36页292
IC封装资料_三极管_BSS138PW_115.pdf
1.Productprofile1.1GeneraldescriptionN-channelenhancementmodeField-EffectTransistor(FET)inaverysmallSOT323(SC-70)Surface-MountedDe...
2024-12-12951989.86 KB16页40
IC封装资料_电容_GRM1885C1H151JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12951944.07 KB30页226
IC封装资料_电容_C3216X5R1V226M160AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129511.67 MB57页208
IC封装资料_电感_NLV25T-R56J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12951318.58 KB6页223
IC封装资料_电源管理芯片_MAX6225AESA+.pdf
GeneralDescriptionTheMAX6225/MAX6241/MAX6250arelow-noise,pre-cisionvoltagereferenceswithextremelylow1ppm/°Ctemperaturecoefficient...
2024-12-129502.39 MB11页173
IC封装资料_电感_SDFL2012T470KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12950457.75 KB7页33
IC封装资料_电容_GJM1555C1H270FB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1295010.43 MB296页59
IC封装资料_电感_MLF2012C101KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-12950441.85 KB11页40
IC封装资料_电容_GRM1555C1H2R0BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12950920.26 KB29页231
IC封装资料_电容_TAJB686M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12950210.32 KB7页199
IC封装资料_电容_GRM188R61A106ME69D.pdf
GRM188R61A106ME69_(0603,X5R:EIA,10uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12950939.11 KB30页122
IC封装资料_三极管_MJD112T4G.pdf
©SemiconductorComponentsIndustries,LLC,2013November,2013−Rev.131PublicationOrderNumber:MJD112/DMJD112(NPN),MJD117(PNP)Complement...
2024-12-12949232.22 KB10页219
IC封装资料_电容_CL10B334KA8VPNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B334KA8VPNCProduct:Multi-layerCeramicCapacitorDescription:CAP,330㎋,25V,±...
2024-12-12949237.83 KB2页1
IC封装资料_电源管理芯片_LT3757EMSE_TRPBF.pdf
LT3757/LT3757A13757afeFormoreinformationwww.linear.com/LT3757nWideInputVoltageRange:2.9Vto40VnPositiveorNegativeOutputVoltageProgr...
2024-12-12949687.18 KB36页219
IC封装资料_电源管理芯片_LT3755EMSE-1_PBF.pdf
LT3755/LT3755-1/LT3755-237551fdTypicalapplicaTionFeaTuresapplicaTionsDescripTion40VIN,75VOUTLEDControllersTheLT®3755,LT3755-1andL...
2024-12-12949433.53 KB26页26

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