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IC资料

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IC封装资料_电容_GCM1555C1H1R0CA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-128205.94 MB73页100
IC封装资料_电容_UMK105CH010CV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12820653.27 KB26页286
IC封装资料_电源管理芯片_LT3012BEFE_TRPBF.pdf
1LT3012B3012bf■WideInputVoltageRange:4Vto80V■LowQuiescentCurrent:40µA■LowDropoutVoltage:400mV■OutputCurrent:250mA■NoProtecti...
2024-12-12820290.09 KB16页27
IC封装资料_电源管理芯片_L7805CDT-TR.pdf
TO-220FPTO-220D²PAKDPAKFeatures•Outputcurrentupto1.5A•Outputvoltagesof5;6;8;8.5;9;12;15;18;24V•Thermaloverloadprotection•Shor...
2024-12-128201.21 MB55页192
IC封装资料_连接器_BM28B0.6-60DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12820562.52 KB8页212
IC封装资料_电容_C0402C220J3GACTU.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12819920.26 KB29页238
IC封装资料_电源管理芯片_LT3741EFE_TRPBF.pdf
LT3741/LT3741-1137411fgFormoreinformationwww.linear.com/LT3741TYPICALAPPLICATIONDESCRIPTIONHighPower,ConstantCurrent,ConstantVolta...
2024-12-12819714.48 KB24页197
IC封装资料_电源管理芯片_LM317MBDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014May,2019−Rev.261PublicationOrderNumber:LM317M/DLM317M,NCV317MA,NCV317M500mAAdjustable...
2024-12-12819324.57 KB15页223
IC封装资料_连接器_1755613.pdf
https://www.phoenixcontact.com/us/produkte/175561311.10.2012Page1/7Basestrip-MSTBVA2,5/13-G-1755613Pleasebeinformedthatthedatashow...
2024-12-12819203.16 KB7页182
IC封装资料_机械式继电器_G6KU-2F-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-128181.72 MB9页279
IC封装资料_电容_GCM188R71E473KA37D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-128184.17 MB96页221
AL-XJD361-F9 (A-BRIGHT).pdf
2006/10/19NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-11818336.16 KB5页157
IC封装资料_电容_1206CG150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128181.05 MB27页9
IC封装资料_连接器_AFC01-S25H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-128181.58 MB1页47
IC封装资料_电容_EMK107ABJ475KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12817653.27 KB26页128
IC封装资料_电容_GRM188R61C225KE15D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12817944.07 KB30页142
IC封装资料_电容_CL10B183JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12817259.57 KB3页47
IC封装资料_电容_CC0603JRNPO9BN561.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128171.22 MB13页198
IC封装资料_电源管理芯片_LTC3639IMSE_TRPBF.pdf
IC封装资料_电源管理芯片_LTC3639IMSE_TRPBF.pdf
2024-12-1281757.86 KB1页7
IC封装资料_电感_HK10052N7S-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12816560.85 KB22页287

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