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IC封装资料_电源管理芯片_SE8533K2-HF.pdf
Rev1.0Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.com.cn•Page1S...
2024-12-12820899.38 KB8页139
IC封装资料_电容_C0402C220J3GACTU.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12819920.26 KB29页238
IC封装资料_电源管理芯片_LM317MBDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014May,2019−Rev.261PublicationOrderNumber:LM317M/DLM317M,NCV317MA,NCV317M500mAAdjustable...
2024-12-12819324.57 KB15页223
IC封装资料_连接器_1755613.pdf
https://www.phoenixcontact.com/us/produkte/175561311.10.2012Page1/7Basestrip-MSTBVA2,5/13-G-1755613Pleasebeinformedthatthedatashow...
2024-12-12819203.16 KB7页182
IC封装资料_机械式继电器_G6KU-2F-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-128181.72 MB9页279
IC封装资料_电容_GCM188R71E473KA37D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-128184.17 MB96页221
IC封装资料_电容_1206CG150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128181.05 MB27页9
IC封装资料_连接器_AFC01-S25H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-128181.58 MB1页47
AL-XJD361-F9 (A-BRIGHT).pdf
2006/10/19NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-11817336.16 KB5页157
IC封装资料_电容_EMK107ABJ475KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12817653.27 KB26页128
IC封装资料_电容_GRM188R61C225KE15D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12817944.07 KB30页142
IC封装资料_电容_CL10B183JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12817259.57 KB3页47
IC封装资料_电容_CC0603JRNPO9BN561.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128171.22 MB13页198
IC封装资料_电源管理芯片_LTC3639IMSE_TRPBF.pdf
IC封装资料_电源管理芯片_LTC3639IMSE_TRPBF.pdf
2024-12-1281757.86 KB1页7
IC封装资料_电感_HK10052N7S-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12816560.85 KB22页287
IC封装资料_电源管理芯片_LTM4637EV_PBF.pdf
LTM463714637fcFormoreinformationwww.linear.com/LTM4637TypicalapplicaTionDescripTion20ADC/DCµModuleStep-DownRegulatorTheLTM®4637i...
2024-12-12816690.71 KB30页132
IC封装资料_电源管理芯片_LT3741EFE_TRPBF.pdf
LT3741/LT3741-1137411fgFormoreinformationwww.linear.com/LT3741TYPICALAPPLICATIONDESCRIPTIONHighPower,ConstantCurrent,ConstantVolta...
2024-12-12816714.48 KB24页197
IC封装资料_电感_MLG1005S3N0ST000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-12816420.58 KB16页185
IC封装资料_电容_CL10C221JC81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12816259.58 KB3页240
IC封装资料_电容_TAJE227K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12816210.32 KB7页135

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